footprints/SH_Solder_Pads.pretty/TH_3P_1.25mm.kicad_mod
2025-03-24 15:22:12 +02:00

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(module TH_3P_1.25mm (layer F.Cu) (tedit 581F5F67)
(solder_mask_margin 0.01)
(attr virtual)
(fp_text reference J2 (at 0 1.1) (layer F.Fab)
(effects (font (size 0.6 0.6) (thickness 0.125)))
)
(fp_text value I2C (at 0 -1.1) (layer F.SilkS)
(effects (font (size 0.6 0.6) (thickness 0.125)))
)
(fp_line (start -1.875 -0.625) (end 1.875 -0.625) (layer F.Fab) (width 0.05))
(fp_line (start 1.875 -0.625) (end 1.875 0.625) (layer F.Fab) (width 0.05))
(fp_line (start 1.875 0.625) (end -1.875 0.625) (layer F.Fab) (width 0.05))
(fp_line (start -1.875 0.625) (end -1.875 -0.625) (layer F.Fab) (width 0.05))
(pad 1 thru_hole rect (at -1.25 0) (size 0.8 1.05) (drill 0.5) (layers *.Cu *.Mask))
(pad 2 thru_hole roundrect (at 0 0) (size 0.8 1.05) (drill 0.5) (layers *.Cu *.Mask)(roundrect_rratio 0.25))
(pad 3 thru_hole roundrect (at 1.25 0) (size 0.8 1.05) (drill 0.5) (layers *.Cu *.Mask)(roundrect_rratio 0.25))
)