(module TH_3P_1.25mm (layer F.Cu) (tedit 581F5F67)
  (solder_mask_margin 0.01)
  (attr virtual)
  (fp_text reference J2 (at 0 1.1) (layer F.Fab)
    (effects (font (size 0.6 0.6) (thickness 0.125)))
  )
  (fp_text value I2C (at 0 -1.1) (layer F.SilkS)
    (effects (font (size 0.6 0.6) (thickness 0.125)))
  )
  (fp_line (start -1.875 -0.625) (end 1.875 -0.625) (layer F.Fab) (width 0.05))
  (fp_line (start 1.875 -0.625) (end 1.875 0.625) (layer F.Fab) (width 0.05))
  (fp_line (start 1.875 0.625) (end -1.875 0.625) (layer F.Fab) (width 0.05))
  (fp_line (start -1.875 0.625) (end -1.875 -0.625) (layer F.Fab) (width 0.05))
  (pad 1 thru_hole rect (at -1.25 0) (size 0.8 1.05) (drill 0.5) (layers *.Cu *.Mask))
  (pad 2 thru_hole roundrect (at 0 0) (size 0.8 1.05) (drill 0.5) (layers *.Cu *.Mask)(roundrect_rratio 0.25))
  (pad 3 thru_hole roundrect (at 1.25 0) (size 0.8 1.05) (drill 0.5) (layers *.Cu *.Mask)(roundrect_rratio 0.25))
)