footprints/SH_Solder_Pads.pretty/6P_Oval_3x1_1.25mm.kicad_mod
2025-03-24 15:22:12 +02:00

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(module 6P_Oval_3x1_1.25mm (layer F.Cu) (tedit 57EA789D)
(solder_mask_margin 0.01)
(attr virtual)
(fp_text reference J1 (at -4.225 0 90) (layer F.SilkS)
(effects (font (size 0.6 0.6) (thickness 0.125)))
)
(fp_text value MCU (at 0 2.05) (layer F.Fab)
(effects (font (size 0.6 0.6) (thickness 0.125)))
)
(fp_circle (center -3.85 1.675) (end -3.75 1.675) (layer F.SilkS) (width 0.2))
(pad 6 connect oval (at 3.125 0) (size 1 3) (layers F.Cu F.Mask))
(pad 5 connect oval (at 1.875 0) (size 1 3) (layers F.Cu F.Mask))
(pad 4 connect oval (at 0.625 0) (size 1 3) (layers F.Cu F.Mask))
(pad 3 connect oval (at -0.625 0) (size 1 3) (layers F.Cu F.Mask))
(pad 2 connect oval (at -1.875 0) (size 1 3) (layers F.Cu F.Mask))
(pad 1 connect rect (at -3.125 0) (size 1 3) (layers F.Cu F.Mask))
)