footprints/SH_Solder_Pads.pretty/6P_2x0.8_1mm_pitch.kicad_mod
2025-03-24 15:22:12 +02:00

15 lines
872 B
Plaintext

(module 6P_2x0.8_1mm_pitch (layer F.Cu) (tedit 5BED3308)
(fp_text reference REF** (at 0 2) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 6P_2x0.8_1mm_pitch (at 0 3) (layer F.Fab) hide
(effects (font (size 0.25 0.25) (thickness 0.05)))
)
(pad 1 connect roundrect (at -2.5 0) (size 0.8 2) (layers F.Cu F.Mask) (roundrect_rratio 0.25))
(pad 2 connect roundrect (at -1.5 0) (size 0.8 2) (layers F.Cu F.Mask) (roundrect_rratio 0.25))
(pad 3 connect roundrect (at -0.5 0) (size 0.8 2) (layers F.Cu F.Mask) (roundrect_rratio 0.25))
(pad 4 connect roundrect (at 0.5 0) (size 0.8 2) (layers F.Cu F.Mask) (roundrect_rratio 0.25))
(pad 5 connect roundrect (at 1.5 0) (size 0.8 2) (layers F.Cu F.Mask) (roundrect_rratio 0.25))
(pad 6 connect roundrect (at 2.5 0) (size 0.8 2) (layers F.Cu F.Mask) (roundrect_rratio 0.25))
)