footprints/SH_Solder_Pads.pretty/5P_2.5x1.05_1.25_pitch_vias.kicad_mod
2025-03-24 15:22:12 +02:00

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(module 5P_2.5x1.05_1.25_pitch_vias (layer F.Cu) (tedit 5BED843F)
(solder_mask_margin 0.001)
(attr virtual)
(fp_text reference J1 (at 0 -4) (layer F.SilkS)
(effects (font (size 0.6 0.6) (thickness 0.125)))
)
(fp_text value A (at -1.8 0 90) (layer F.Fab)
(effects (font (size 0.6 0.6) (thickness 0.125)))
)
(pad 1 connect rect (at 0 -2.5) (size 2.5 1.05) (layers F.Cu F.Mask)
(zone_connect 0))
(pad 2 connect roundrect (at 0 -1.25) (size 2.5 1.05) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(zone_connect 2))
(pad 3 connect roundrect (at 0 0) (size 2.5 1.05) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(zone_connect 0))
(pad 4 connect roundrect (at 0 1.25) (size 2.5 1.05) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(zone_connect 0))
(pad 5 connect roundrect (at 0 2.5) (size 2.5 1.05) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(zone_connect 0))
(pad 1 thru_hole circle (at 0.75 -2.5) (size 0.68 0.68) (drill 0.3304) (layers *.Cu *.Mask))
(pad 2 thru_hole circle (at 0.75 -1.25) (size 0.68 0.68) (drill 0.3304) (layers *.Cu *.Mask))
(pad 3 thru_hole circle (at 0.75 0) (size 0.68 0.68) (drill 0.3304) (layers *.Cu *.Mask))
(pad 4 thru_hole circle (at 0.75 1.25) (size 0.68 0.68) (drill 0.3304) (layers *.Cu *.Mask))
(pad 5 thru_hole circle (at 0.75 2.5) (size 0.68 0.68) (drill 0.3304) (layers *.Cu *.Mask))
)