footprints/SH_Solder_Pads.pretty/4P_4.5x4_5_pitch.kicad_mod
2025-03-24 15:22:12 +02:00

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(module 4P_4.5x4_5_pitch (layer F.Cu) (tedit 5C40DF23)
(attr virtual)
(fp_text reference M1 (at 0 -10.5 -180) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value STEPPER (at 2.5 0 -90) (layer F.Fab)
(effects (font (size 0.25 0.25) (thickness 0.05)))
)
(pad 1 connect roundrect (at 0 -7.5) (size 4.5 4) (layers F.Cu F.Mask) (roundrect_rratio 0.167))
(pad 2 connect roundrect (at 0 -2.5) (size 4.5 4) (layers F.Cu F.Mask) (roundrect_rratio 0.167))
(pad 3 connect roundrect (at 0 2.5) (size 4.5 4) (layers F.Cu F.Mask) (roundrect_rratio 0.167))
(pad 4 connect roundrect (at 0 7.5) (size 4.5 4) (layers F.Cu F.Mask) (roundrect_rratio 0.167))
)