footprints/SH_Solder_Pads.pretty/4P_2.5x1.05_1.25_pitch.kicad_mod
2025-03-24 15:22:12 +02:00

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(module 4P_2.5x1.05_1.25_pitch (layer F.Cu) (tedit 5C18C584)
(solder_mask_margin 0.001)
(attr virtual)
(fp_text reference J1 (at 0 -2.875) (layer F.SilkS)
(effects (font (size 0.6 0.6) (thickness 0.125)))
)
(fp_text value 4P_2.5x1.05_1.25_pitch (at -1.8 0 90) (layer F.Fab)
(effects (font (size 0.6 0.6) (thickness 0.125)))
)
(pad 1 connect rect (at 0 -1.875) (size 2.5 1.05) (layers F.Cu F.Mask)
(zone_connect 0))
(pad 2 connect roundrect (at 0 -0.625) (size 2.5 1.05) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(zone_connect 2))
(pad 3 connect roundrect (at 0 0.625) (size 2.5 1.05) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(zone_connect 0))
(pad 4 connect roundrect (at 0 1.875) (size 2.5 1.05) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(zone_connect 0))
)