footprints/SH_Solder_Pads.pretty/2P_4.5x5_5.5_pitch.kicad_mod
2025-03-24 15:22:12 +02:00

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(module 2P_4.5x5_5.5_pitch (layer F.Cu) (tedit 5C40DB55)
(attr virtual)
(fp_text reference J2 (at 0 -6.25 -180) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value VIN (at 2.8 0 -90) (layer F.Fab)
(effects (font (size 0.25 0.25) (thickness 0.05)))
)
(pad 2 connect roundrect (at 0 2.75) (size 4.5 5) (layers F.Cu F.Mask) (roundrect_rratio 0.167))
(pad 1 connect roundrect (at 0 -2.75) (size 4.5 5) (layers F.Cu F.Mask) (roundrect_rratio 0.167))
)