footprints/SH_Solder_Pads.pretty/2P_3.5x3_3.5_pitch.kicad_mod
2025-03-24 15:22:12 +02:00

12 lines
491 B
Plaintext

(module 2P_3.5x3_3.5_pitch (layer F.Cu) (tedit 5C3E33C4)
(attr virtual)
(fp_text reference J2 (at 0 -4 180) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value VIN (at 2.8 0 270) (layer F.Fab)
(effects (font (size 0.25 0.25) (thickness 0.05)))
)
(pad 2 connect roundrect (at 0 1.75) (size 3.5 3) (layers F.Cu F.Mask) (roundrect_rratio 0.167))
(pad 1 connect roundrect (at 0 -1.75) (size 3.5 3) (layers F.Cu F.Mask) (roundrect_rratio 0.167))
)