73 lines
5.2 KiB
Plaintext
73 lines
5.2 KiB
Plaintext
(footprint "Nexperia_WLCSP-10_4-2-4_1.57x1.17mm_Layout4x2_P0.4mm" (version 20221018) (generator pcbnew)
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(layer "F.Cu")
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(descr "Nexperia wafer level chip-size package; 10 bumps (4-2-4), 1.57x1.17mm, 10 Ball, 4x2 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf")
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(tags "CSP 10 0.4")
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(property "Sheetfile" "Samsung_S5KGN2_Module.kicad_sch")
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(property "Sheetname" "")
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(property "ki_description" "Common-mode EMI filter for differential channels with integrated ESD protection")
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(property "ki_keywords" "Common Mode ESD")
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(solder_mask_margin 0.0375)
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(attr smd)
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(fp_text reference "U8" (at 0 -1.4) (layer "F.SilkS")
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(effects (font (size 0.8 0.8) (thickness 0.15)))
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(tstamp 56cc4e68-a0a8-4d7a-9b50-6c093184d301)
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)
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(fp_text value "PCMF3USB3S" (at 0 1.075) (layer "F.Fab")
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(effects (font (size 0.25 0.25) (thickness 0.0625)))
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(tstamp 3086c199-7539-45e7-8318-d4b5e4b747bb)
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)
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(fp_text user "${REFERENCE}" (at 0 1.425) (layer "F.Fab")
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(effects (font (size 0.25 0.25) (thickness 0.0625)))
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)
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(fp_line (start -0.985 0.785) (end -0.985 -0.4475)
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(pad "B1" smd circle (at -0.4 0) (size 0.25 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 30158465-be3a-4169-864b-89d3c8143085))
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(pad "C4" smd circle (at 0.6 0.4) (size 0.25 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 45d75c6d-94cf-47ff-88bb-0896fc22d881))
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(model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/Nexperia_WLCSP-15_6-3-6_2.37x1.17mm_Layout6x3_P0.4mm.wrl"
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(offset (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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