(module WSON-6_2x2_0.5_TE (layer F.Cu) (tedit 5985C5F5)
  (solder_mask_margin 0.05)
  (solder_paste_margin -0.05)
  (solder_paste_ratio -0.003)
  (fp_text reference REF** (at 0 -2.25) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value WSON-6_2x2_0.5_TE (at 0 1.75) (layer F.Fab)
    (effects (font (size 0.25 0.25) (thickness 0.0625)))
  )
  (fp_line (start -1 -1) (end 1 -1) (layer F.Fab) (width 0.1))
  (fp_line (start 1 -1) (end 1 1) (layer F.Fab) (width 0.1))
  (fp_line (start 1 1) (end -1 1) (layer F.Fab) (width 0.1))
  (fp_line (start -1 1) (end -1 -1) (layer F.Fab) (width 0.1))
  (fp_line (start -1.25 -1.25) (end 1.25 -1.25) (layer F.CrtYd) (width 0.05))
  (fp_line (start 1.25 -1.25) (end 1.25 1.25) (layer F.CrtYd) (width 0.05))
  (fp_line (start 1.25 1.25) (end -1.25 1.25) (layer F.CrtYd) (width 0.05))
  (fp_line (start -1.25 1.25) (end -1.25 -1.25) (layer F.CrtYd) (width 0.05))
  (fp_line (start -1.1 -1) (end -1.1 1) (layer F.SilkS) (width 0.15))
  (fp_line (start 1.1 -1) (end 1.1 1) (layer F.SilkS) (width 0.15))
  (fp_circle (center -1.1 1.3) (end -1 1.3) (layer F.SilkS) (width 0.15))
  (pad 7 smd roundrect (at 0 0) (size 1.8 1) (layers F.Cu F.Mask)(roundrect_rratio 0.1))
  (pad 1 smd roundrect (at -0.65 1.05) (size 0.25 0.65) (layers F.Cu F.Mask)(roundrect_rratio 0.1))
  (pad 2 smd roundrect (at 0 1.05) (size 0.25 0.65) (layers F.Cu F.Mask)(roundrect_rratio 0.1))
  (pad 3 smd roundrect (at 0.65 1.05) (size 0.25 0.65) (layers F.Cu F.Mask)(roundrect_rratio 0.1))
  (pad 4 smd roundrect (at 0.65 -1.05) (size 0.25 0.65) (layers F.Cu F.Mask)(roundrect_rratio 0.1))
  (pad 5 smd roundrect (at 0 -1.05) (size 0.25 0.65) (layers F.Cu F.Mask)(roundrect_rratio 0.1))
  (pad 6 smd roundrect (at -0.65 -1.05) (size 0.25 0.65) (layers F.Cu F.Mask)(roundrect_rratio 0.1))
  (pad 8 thru_hole circle (at -0.5 0) (size 0.6 0.6) (drill 0.3302) (layers *.Cu))
  (pad 9 thru_hole circle (at 0.5 0) (size 0.6 0.6) (drill 0.3302) (layers *.Cu))
)