(module DFN-4_1.2x1.6_0.5mm (layer F.Cu) (tedit 58CC2D89)
  (solder_mask_margin 0.025)
  (solder_paste_margin -0.03)
  (fp_text reference REF** (at -1.05 0 90) (layer F.SilkS)
    (effects (font (size 0.6 0.6) (thickness 0.125)))
  )
  (fp_text value DFN-4_1.2x1.6_0.5mm (at 0.75 0 90) (layer F.Fab)
    (effects (font (size 0.127 0.127) (thickness 0.03175)))
  )
  (fp_line (start -0.6 -0.8) (end 0.6 -0.8) (layer F.Fab) (width 0.05))
  (fp_line (start 0.6 -0.8) (end 0.6 0.8) (layer F.Fab) (width 0.05))
  (fp_line (start 0.6 0.8) (end -0.6 0.8) (layer F.Fab) (width 0.05))
  (fp_line (start -0.6 0.8) (end -0.6 -0.8) (layer F.Fab) (width 0.05))
  (fp_circle (center -0.25 1.125) (end -0.2 1.125) (layer F.SilkS) (width 0.125))
  (pad 1 smd roundrect (at -0.25 0.7) (size 0.25 0.5) (layers F.Cu F.Paste F.Mask)(roundrect_rratio 0.25))
  (pad 2 smd roundrect (at 0.25 0.7) (size 0.25 0.5) (layers F.Cu F.Paste F.Mask)(roundrect_rratio 0.25))
  (pad 3 smd roundrect (at 0.25 -0.7) (size 0.25 0.5) (layers F.Cu F.Paste F.Mask)(roundrect_rratio 0.25))
  (pad 4 smd roundrect (at -0.25 -0.7) (size 0.25 0.5) (layers F.Cu F.Paste F.Mask)(roundrect_rratio 0.25))
  (pad 5 thru_hole circle (at 0 0) (size 0.4 0.4) (drill 0.3302) (layers *.Cu F.Mask))
  (pad 5 smd roundrect (at -0.275 0) (size 0.3 0.5) (layers F.Cu F.Paste F.Mask)(roundrect_rratio 0.25)
    (solder_paste_margin -0.001) (zone_connect 2))
  (pad 5 smd roundrect (at 0.275 0) (size 0.3 0.5) (layers F.Cu F.Paste F.Mask)(roundrect_rratio 0.25)
    (solder_paste_margin -0.001) (zone_connect 2))
  (pad 5 connect roundrect (at 0 0) (size 0.86 0.5) (layers F.Cu F.Mask)(roundrect_rratio 0.1)
    (zone_connect 2))
)