(footprint "Nexperia_WLCSP-10_4-2-4_1.57x1.17mm_Layout4x2_P0.4mm" (version 20221018) (generator pcbnew)
  (layer "F.Cu")
  (descr "Nexperia wafer level chip-size package; 10 bumps (4-2-4), 1.57x1.17mm, 10 Ball, 4x2 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf")
  (tags "CSP 10 0.4")
  (property "Sheetfile" "Samsung_S5KGN2_Module.kicad_sch")
  (property "Sheetname" "")
  (property "ki_description" "Common-mode EMI filter for differential channels with integrated ESD protection")
  (property "ki_keywords" "Common Mode ESD")
  (solder_mask_margin 0.0375)
  (attr smd)
  (fp_text reference "U8" (at 0 -1.4) (layer "F.SilkS")
      (effects (font (size 0.8 0.8) (thickness 0.15)))
    (tstamp 56cc4e68-a0a8-4d7a-9b50-6c093184d301)
  )
  (fp_text value "PCMF3USB3S" (at 0 1.075) (layer "F.Fab")
      (effects (font (size 0.25 0.25) (thickness 0.0625)))
    (tstamp 3086c199-7539-45e7-8318-d4b5e4b747bb)
  )
  (fp_text user "${REFERENCE}" (at 0 1.425) (layer "F.Fab")
      (effects (font (size 0.25 0.25) (thickness 0.0625)))
    (tstamp d6c0c246-40fe-422b-82a7-726ee5dcdb94)
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    (stroke (width 0.05) (type default)) (layer "F.CrtYd") (tstamp 699a9adc-9a55-46cc-a615-89fac64d655d))
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  (fp_line (start 0.785 0.585) (end -0.785 0.585)
    (stroke (width 0.1) (type solid)) (layer "F.Fab") (tstamp 853e4c0c-2fbb-4098-a427-1607c93d3114))
  (pad "A1" smd circle (at -0.6 -0.4) (size 0.25 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 4fa57d3e-c0dc-40ed-89a4-664222492fb6))
  (pad "A2" smd circle (at -0.2 -0.4) (size 0.25 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 270b3044-2d04-4170-82e4-00b5fdaa8113))
  (pad "A3" smd circle (at 0.2 -0.4) (size 0.25 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 7d17163e-9035-4d30-9736-3fe1cd5e1352))
  (pad "A4" smd circle (at 0.6 -0.4) (size 0.25 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 8e510074-12df-437b-b8c5-a2db10c1fce4))
  (pad "B1" smd circle (at -0.4 0) (size 0.25 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 30158465-be3a-4169-864b-89d3c8143085))
  (pad "B2" smd circle (at 0.4 0) (size 0.25 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 757f39d1-5d51-4627-be55-788d14659be9))
  (pad "C1" smd circle (at -0.6 0.4) (size 0.25 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 23e51bfa-469b-42d4-a2ec-f32af0cf5b83))
  (pad "C2" smd circle (at -0.2 0.4) (size 0.25 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 2dbd0ace-b81e-4b64-b4aa-0b921b522ba6))
  (pad "C3" smd circle (at 0.2 0.4) (size 0.25 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 8bd1be27-f4ff-44aa-9c7c-f2689e43efdf))
  (pad "C4" smd circle (at 0.6 0.4) (size 0.25 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 45d75c6d-94cf-47ff-88bb-0896fc22d881))
  (model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/Nexperia_WLCSP-15_6-3-6_2.37x1.17mm_Layout6x3_P0.4mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
