(footprint "Thundercomm_C6490" (version 20220427) (generator pcbnew)
  (layer "F.Cu")
  (attr smd)
  (fp_text reference "REF**" (at 0 -18.75 unlocked) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
    (tstamp a487d4ae-37b1-41ba-a5bd-b67bb768f608)
  )
  (fp_text value "Thundercomm_C6490" (at -0.25 10.5 unlocked) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 74e882c7-9436-4259-b235-db89478d5b95)
  )
  (fp_text user "${REFERENCE}" (at 0 -10.25 unlocked) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 2a1151ee-73b4-4c18-844d-39010e0cde80)
  )
  (fp_arc (start -21.825 -18.25) (mid -21.803033 -18.303033) (end -21.75 -18.325)
    (stroke (width 0.15) (type solid)) (layer "F.SilkS") (tstamp 840edcb2-48a1-4d01-9362-d2ffd85377d4))
  (fp_arc (start -21.75 18.325) (mid -21.803033 18.303033) (end -21.825 18.25)
    (stroke (width 0.15) (type solid)) (layer "F.SilkS") (tstamp 1c23836c-9996-44c2-93a4-0e05c8f8cae1))
  (fp_arc (start 21.75 -18.325) (mid 21.803033 -18.303033) (end 21.825 -18.25)
    (stroke (width 0.15) (type solid)) (layer "F.SilkS") (tstamp 4df45f8f-2790-442b-b9cd-5042830fe0c1))
  (fp_arc (start 21.825 18.25) (mid 21.803033 18.303033) (end 21.75 18.325)
    (stroke (width 0.15) (type solid)) (layer "F.SilkS") (tstamp 0e85f777-ac43-4f47-b453-34e633057ab6))
  (fp_poly
    (pts
      (xy -18.85 18.25)
      (xy -18.5 18.75)
      (xy -19.2 18.75)
    )

    (stroke (width 0) (type solid)) (fill solid) (layer "F.SilkS") (tstamp f6f0c1cb-6c34-4454-ac78-e5dad4eed84f))
  (fp_poly
    (pts
      (xy -21.75 15.75)
      (xy -21.75 18.25)
      (xy -19.25 18.25)
      (xy -19.25 18.4)
      (xy -21.75 18.4)
      (xy -21.9 18.25)
      (xy -21.9 15.75)
    )

    (stroke (width 0) (type solid)) (fill solid) (layer "F.SilkS") (tstamp f6bb4cd0-4e8a-4bc1-8a46-77d988c97dec))
  (fp_poly
    (pts
      (xy -19.25 -18.25)
      (xy -21.75 -18.25)
      (xy -21.75 -15.75)
      (xy -21.9 -15.75)
      (xy -21.9 -18.25)
      (xy -21.75 -18.4)
      (xy -19.25 -18.4)
    )

    (stroke (width 0) (type solid)) (fill solid) (layer "F.SilkS") (tstamp 95231e02-0368-42c7-bf20-3aae3f45fe67))
  (fp_poly
    (pts
      (xy 19.25 18.25)
      (xy 21.75 18.25)
      (xy 21.75 15.75)
      (xy 21.9 15.75)
      (xy 21.9 18.25)
      (xy 21.75 18.4)
      (xy 19.25 18.4)
    )

    (stroke (width 0) (type solid)) (fill solid) (layer "F.SilkS") (tstamp 1774dc71-fc4a-47c6-b1d0-8e6d109ac0d9))
  (fp_poly
    (pts
      (xy 21.75 -15.75)
      (xy 21.75 -18.25)
      (xy 19.25 -18.25)
      (xy 19.25 -18.4)
      (xy 21.75 -18.4)
      (xy 21.9 -18.25)
      (xy 21.9 -15.75)
    )

    (stroke (width 0) (type solid)) (fill solid) (layer "F.SilkS") (tstamp cb7417fa-ce82-4cce-9958-9dc19aeac7e7))
  (fp_line (start -21.75 17.75) (end -21.75 -17.75)
    (stroke (width 0.05) (type default)) (layer "F.CrtYd") (tstamp 5baca8eb-7310-43b7-a7c8-e8fb71001269))
  (fp_line (start -21.25 -18.25) (end 21.25 -18.25)
    (stroke (width 0.05) (type default)) (layer "F.CrtYd") (tstamp 2ef60d4f-0da1-454e-82f3-56630d40eb19))
  (fp_line (start 21.25 18.25) (end -21.25 18.25)
    (stroke (width 0.05) (type default)) (layer "F.CrtYd") (tstamp f222fbae-294f-4cf6-9cec-a16075e44149))
  (fp_line (start 21.75 -17.75) (end 21.75 17.75)
    (stroke (width 0.05) (type default)) (layer "F.CrtYd") (tstamp 7a896023-3d18-42af-87e5-7f795361b21e))
  (fp_arc (start -21.75 -17.75) (mid -21.603553 -18.103553) (end -21.25 -18.25)
    (stroke (width 0.05) (type default)) (layer "F.CrtYd") (tstamp 99f5e903-7e8c-4185-8ca9-3396fc5f0e08))
  (fp_arc (start -21.25 18.25) (mid -21.603553 18.103553) (end -21.75 17.75)
    (stroke (width 0.05) (type default)) (layer "F.CrtYd") (tstamp 08715aea-94eb-4df2-9d7f-f7a78f4a5ec5))
  (fp_arc (start 21.25 -18.25) (mid 21.603553 -18.103553) (end 21.75 -17.75)
    (stroke (width 0.05) (type default)) (layer "F.CrtYd") (tstamp 179c1ce2-0402-4b68-bfd9-aec0c3f03b50))
  (fp_arc (start 21.75 17.75) (mid 21.603553 18.103553) (end 21.25 18.25)
    (stroke (width 0.05) (type default)) (layer "F.CrtYd") (tstamp 7646d465-120f-42b7-a63b-af09ffee323e))
  (fp_rect (start -21.25 17.75) (end 21.25 -17.75)
    (stroke (width 0.1) (type default)) (fill none) (layer "F.Fab") (tstamp acb7b55c-65e7-4ac3-b092-1f47cc8be849))
  (pad "" smd roundrect (at -19.5 -15.75 270) (size 1.8 1.8) (layers "F.Paste") (roundrect_rratio 0.5)
    (chamfer_ratio 0.5) (chamfer bottom_left) (tstamp ea8fe830-a802-46b7-a078-2c00f613439e))
  (pad "" smd roundrect (at -19.5 15.75) (size 1.8 1.8) (layers "F.Paste") (roundrect_rratio 0.5)
    (chamfer_ratio 0.5) (chamfer bottom_left) (tstamp cc91e3c6-9d80-4225-bbf9-778588435314))
  (pad "" smd circle (at -3.2 -1.6) (size 1.8 1.8) (layers "F.Paste") (tstamp e3291e4b-dd97-4718-bb84-9c49cd30d08f))
  (pad "" smd circle (at -3.2 1.6) (size 1.8 1.8) (layers "F.Paste") (tstamp af343736-ae6a-4d0e-931b-b2e9d86d248b))
  (pad "" smd circle (at 0 -1.6) (size 1.8 1.8) (layers "F.Paste") (tstamp 0897d20c-12f2-44c4-b488-493b69be3d0b))
  (pad "" smd circle (at 0 1.6) (size 1.8 1.8) (layers "F.Paste") (tstamp 832cdab0-b676-41c1-92d4-3d6ede12e2f4))
  (pad "" smd circle (at 3.2 -1.6) (size 1.8 1.8) (layers "F.Paste") (tstamp 62ed0446-12e1-4ff3-b99a-3e7cc9496b5d))
  (pad "" smd circle (at 3.2 1.6) (size 1.8 1.8) (layers "F.Paste") (tstamp 64ec5d58-b213-4286-a5be-1acb41d91cca))
  (pad "" smd roundrect (at 19.5 -15.75 180) (size 1.8 1.8) (layers "F.Paste") (roundrect_rratio 0.5)
    (chamfer_ratio 0.5) (chamfer bottom_left) (tstamp 37a2e00c-73b2-4dff-bc87-460647f84d3d))
  (pad "" smd roundrect (at 19.5 15.75 90) (size 1.8 1.8) (layers "F.Paste") (roundrect_rratio 0.5)
    (chamfer_ratio 0.5) (chamfer bottom_left) (tstamp 47eb43be-9216-4f3c-8ec6-df77dfc8e3f7))
  (pad "A3" smd circle (at -17.25 16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 7ecc681f-81a6-4c95-af13-edbc03798237))
  (pad "A4" smd circle (at -15.75 16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp b80d14a2-2155-4550-8f08-128bb70eef32))
  (pad "A5" smd circle (at -14.25 16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 59d6bed2-15db-4dab-85e0-a3755a0a72bc))
  (pad "A6" smd circle (at -12.75 16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 28152d32-ffa8-4b5b-86f1-cb8ddce9a1b1))
  (pad "A7" smd circle (at -11.25 16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 42c1d1d1-4ef2-47a1-bb0d-04eb892c2861))
  (pad "A8" smd circle (at -9.75 16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp bf868bd9-436f-40ee-8e9f-74782c622fb7))
  (pad "A9" smd circle (at -8.25 16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 386e40b8-5a17-4f51-bf57-282effbfe9f2))
  (pad "A10" smd circle (at -6.75 16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp dfcf952b-aa1b-487b-8fdd-9315b37f12ee))
  (pad "A11" smd circle (at -5.25 16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 187aa1e3-e5e6-4433-9a46-f3660563da8d))
  (pad "A12" smd circle (at -3.75 16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 424eb3f8-4f05-41ed-802d-6ab20b1050b1))
  (pad "A13" smd circle (at -2.25 16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 8da59fc4-2b19-4b70-a44d-e1c189b0766b))
  (pad "A14" smd circle (at -0.75 16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 4f2c94e5-aea5-4103-834d-d8d9cf1c73f9))
  (pad "A15" smd circle (at 0.75 16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 4b875fc1-01c3-46ec-a9ef-ad1709b9553a))
  (pad "A16" smd circle (at 2.25 16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 5f757935-6143-49f5-b68a-b23eb34f5121))
  (pad "A17" smd circle (at 3.75 16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 62cfae75-46cd-4469-98c3-6e8c2561662d))
  (pad "A18" smd circle (at 5.25 16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 4ae2e6d1-af42-4268-a294-8bd14fed314c))
  (pad "A19" smd circle (at 6.75 16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 37ccec57-70d8-4bec-bba7-bc6c82a8d037))
  (pad "A20" smd circle (at 8.25 16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 14252d3b-5cc7-4b17-a62e-27248daebb97))
  (pad "A21" smd circle (at 9.75 16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 2277733e-c02e-4546-bff9-fcc6ec4ca1f7))
  (pad "A22" smd circle (at 11.25 16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 20c1f7fd-0f2a-43fe-aefb-ee89fd2e0192))
  (pad "A23" smd circle (at 12.75 16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 85a04d2f-db40-492d-a365-dbca3f8f67c8))
  (pad "A24" smd circle (at 14.25 16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 4461756c-ddfb-46ac-beba-c70d6fbc0d1e))
  (pad "A25" smd circle (at 15.75 16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 08297fcf-d951-4e37-8fe4-b231e1de351f))
  (pad "A26" smd circle (at 17.25 16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 169c303c-e0cd-44d7-afdf-a331877a37bd))
  (pad "AA1" smd circle (at -20.25 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 09ab04aa-ba7b-4122-a57e-bdbc435b009f))
  (pad "AA2" smd circle (at -18.75 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 81ebd603-728f-4787-a9ad-636cf8dda28e))
  (pad "AA3" smd circle (at -17.25 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 9bcbb6bf-aae5-4ee9-b22a-7adfbed482d7))
  (pad "AA4" smd circle (at -15.75 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 48063cba-d036-4a7d-8533-c208192a8c68))
  (pad "AA5" smd circle (at -14.25 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 858226f0-4bf4-4d79-ab95-074a24c8355b))
  (pad "AA6" smd circle (at -12.75 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 4b9bf055-9cc2-4840-9a89-7c2c23bba787))
  (pad "AA7" smd circle (at -11.25 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 7566ea5a-c8d4-4f73-8129-065edb90c5ef))
  (pad "AA8" smd circle (at -9.75 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 35b3992f-122c-4547-a228-d801700e06cd))
  (pad "AA9" smd circle (at -8.25 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 6216621e-b4db-4779-9dc3-19ad3d87c234))
  (pad "AA10" smd circle (at -6.75 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp b0a859c6-2333-4fa8-b3fd-fcc870a2c780))
  (pad "AA11" smd circle (at -5.25 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 2a825734-0330-46e7-9aaf-34971b5dc9d8))
  (pad "AA12" smd circle (at -3.75 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 6335ba32-7f0f-40ff-90a1-01cab94e486a))
  (pad "AA13" smd circle (at -2.25 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp a0524bc2-56ec-4292-bef7-b7d2d8f28c6a))
  (pad "AA14" smd circle (at -0.75 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp e7381ac4-caa3-41fd-b7c7-2d88e4746b51))
  (pad "AA15" smd circle (at 0.75 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp f6fda29c-e10b-4f2b-a383-78a729eb5f15))
  (pad "AA16" smd circle (at 2.25 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 6d114730-1abc-4eda-9f14-1cbe50087709))
  (pad "AA17" smd circle (at 3.75 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp af116f6d-0d39-49a8-851c-d99cdfc0d4cc))
  (pad "AA18" smd circle (at 5.25 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 50d0ef86-071d-45b8-9fc5-a9b11c5e5bba))
  (pad "AA19" smd circle (at 6.75 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 19dff462-957a-445e-be3b-640d46234a82))
  (pad "AA20" smd circle (at 8.25 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp f9a6b648-1271-4da2-b88a-a8853311e013))
  (pad "AA21" smd circle (at 9.75 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp bee7a2c9-da99-40ce-9d86-888450aa173e))
  (pad "AA22" smd circle (at 11.25 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 26c6f48b-0fd8-4746-82ab-772c241e393e))
  (pad "AA23" smd circle (at 12.75 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp abfb5711-1d47-4f03-bce7-16b1df2dbda7))
  (pad "AA24" smd circle (at 14.25 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 6311e480-13ff-4e72-817c-920f4e3ca8d0))
  (pad "AA25" smd circle (at 15.75 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 9f73aaa9-ab47-4063-9fcf-a20932046a8c))
  (pad "AA26" smd circle (at 17.25 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 31279b39-328f-4440-8624-aa5cb73550a2))
  (pad "AA27" smd circle (at 18.75 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 85e88d7d-094f-4d3a-8893-f78d7af050dd))
  (pad "AA28" smd circle (at 20.25 -13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 7cf39174-4826-4e90-90f2-943a4fbc5a4d))
  (pad "AB3" smd circle (at -17.25 -15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 4ad4a3d4-4cd4-43de-b7f1-cec38c601c25))
  (pad "AB4" smd circle (at -15.75 -15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 2a75d38c-3c2e-43d5-8aa0-d5ee88c404b6))
  (pad "AB5" smd circle (at -14.25 -15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp c6b05053-6071-4116-a455-94f5a4ebca91))
  (pad "AB6" smd circle (at -12.75 -15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 6b512398-7f1c-42b6-b2c1-670c431b3d0e))
  (pad "AB7" smd circle (at -11.25 -15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 1809c8a9-d0c9-4756-b3c1-9e1395f50aae))
  (pad "AB8" smd circle (at -9.75 -15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 39033a8d-4ae1-4a91-8276-235ebd00ec81))
  (pad "AB9" smd circle (at -8.25 -15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 87b499d8-4b6a-4219-8ec3-a892ccfcfb27))
  (pad "AB10" smd circle (at -6.75 -15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 2affc337-4108-460e-a512-10dcb246fa6c))
  (pad "AB11" smd circle (at -5.25 -15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp e6e332d0-56f1-4338-8202-1feb8a479a3c))
  (pad "AB12" smd circle (at -3.75 -15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 633474ff-1fc6-436a-b41f-1d839e04c1d6))
  (pad "AB13" smd circle (at -2.25 -15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp bf86890b-f701-4087-a0a9-ae561b25ef52))
  (pad "AB14" smd circle (at -0.75 -15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp b77eb4f1-5b6a-45dc-9d4f-68a1eef63754))
  (pad "AB15" smd circle (at 0.75 -15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 4bad17a8-593c-478a-9b54-3e556b635985))
  (pad "AB16" smd circle (at 2.25 -15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 64649894-b796-4585-ae1d-f657c48822af))
  (pad "AB17" smd circle (at 3.75 -15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp c027220e-bddd-4d1e-ad43-c453f3828661))
  (pad "AB18" smd circle (at 5.25 -15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp c1963116-de37-4d1b-9a8f-af190b025210))
  (pad "AB19" smd circle (at 6.75 -15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp bd70053c-f643-4e27-aeff-76f518e356ff))
  (pad "AB20" smd circle (at 8.25 -15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp db090fd8-5860-4918-8134-dbe272869ed7))
  (pad "AB21" smd circle (at 9.75 -15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 131e304e-e8a3-4f00-ba48-7664c33941d4))
  (pad "AB22" smd circle (at 11.25 -15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 8e39c9a4-033b-41af-bffa-cd74d54e0557))
  (pad "AB23" smd circle (at 12.75 -15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 3c1bc5dd-766f-4e9f-a979-cac16cc70a38))
  (pad "AB24" smd circle (at 14.25 -15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp df20a0d8-71b2-440a-af71-979bbd16da4c))
  (pad "AB25" smd circle (at 15.75 -15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp f7b2c15b-57c6-453a-b859-115c4c9b41d4))
  (pad "AB26" smd circle (at 17.25 -15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp bfb27ab6-0ce1-4533-8bf3-fffff30787bb))
  (pad "AC3" smd circle (at -17.25 -16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 222b542a-2171-4f09-8b81-02f36b581850))
  (pad "AC4" smd circle (at -15.75 -16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp f61010ec-b44d-4d1e-b13a-9a8f63f41211))
  (pad "AC5" smd circle (at -14.25 -16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 78827278-7347-4024-8d2a-3cbf9a0eff92))
  (pad "AC6" smd circle (at -12.75 -16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 0ee00da1-4520-46e0-ab81-ef09f42bb10a))
  (pad "AC7" smd circle (at -11.25 -16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 9a041b7a-dc55-4aa2-97ba-575803f379ce))
  (pad "AC8" smd circle (at -9.75 -16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 3940ab87-fc6b-4b49-8f8c-11aea4c344a6))
  (pad "AC9" smd circle (at -8.25 -16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 47db1c03-d8b7-4bde-b987-51b267806ca2))
  (pad "AC10" smd circle (at -6.75 -16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp b237f383-c1ba-4516-aef6-f5c18b42ace5))
  (pad "AC11" smd circle (at -5.25 -16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 36699f58-6346-4040-bc17-653bbfaedca1))
  (pad "AC12" smd circle (at -3.75 -16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp ed03e0d9-52b0-4629-b79e-cbb036a5553d))
  (pad "AC13" smd circle (at -2.25 -16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 870d43a3-bdfc-4679-8bba-221589433c5e))
  (pad "AC14" smd circle (at -0.75 -16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 13d2997d-9ddc-4247-ad5a-65a0d8070183))
  (pad "AC15" smd circle (at 0.75 -16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 0db60501-9fc4-484e-a29d-2f4e626b9555))
  (pad "AC16" smd circle (at 2.25 -16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 46d29f15-4acf-4cc2-a310-522b69039bc0))
  (pad "AC17" smd circle (at 3.75 -16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 45238882-7832-49a9-b9f7-bdeb2711604c))
  (pad "AC18" smd circle (at 5.25 -16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 79124100-9e40-4aff-aff4-2076e86b9802))
  (pad "AC19" smd circle (at 6.75 -16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 86bdff75-3eb9-4dfa-91a1-151885d2883b))
  (pad "AC20" smd circle (at 8.25 -16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 578757be-11a5-4db9-8caa-510cd1f29a5a))
  (pad "AC21" smd circle (at 9.75 -16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 44a789da-f16c-419a-bd1f-17db115f9b90))
  (pad "AC22" smd circle (at 11.25 -16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp d662c745-6ceb-4eff-90a8-b773a1ed21a4))
  (pad "AC23" smd circle (at 12.75 -16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 45b54fe5-4c48-4973-a22d-1e79ead4b54b))
  (pad "AC24" smd circle (at 14.25 -16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 34ae8ee5-0b8d-45fd-99f2-9276d302daf2))
  (pad "AC25" smd circle (at 15.75 -16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp c2f39147-fd97-45ff-87c3-72b8d7eccebb))
  (pad "AC26" smd circle (at 17.25 -16.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 60077369-9699-488e-b08d-39282ee53e30))
  (pad "B3" smd circle (at -17.25 15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp d9d53d95-2f54-4b40-9bb7-67fc9aa34304))
  (pad "B4" smd circle (at -15.75 15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 95e7d982-16ff-4d07-9d8a-98bdbaa062ee))
  (pad "B5" smd circle (at -14.25 15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp a83e1bfd-a00b-429e-9849-a9714e93c512))
  (pad "B6" smd circle (at -12.75 15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp e9387c20-e91a-4ef1-b27a-123ad42c72e4))
  (pad "B7" smd circle (at -11.25 15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 3df82fb7-4fa6-416a-9314-d6b86b9493d6))
  (pad "B8" smd circle (at -9.75 15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp cae6c9a6-2d48-489d-bbf2-bb7546e4bbbc))
  (pad "B9" smd circle (at -8.25 15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 14886d6c-2a20-42dd-aa95-3651444b7209))
  (pad "B10" smd circle (at -6.75 15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 7f442c35-7706-43be-8bc5-f293940ecf27))
  (pad "B11" smd circle (at -5.25 15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 30038be0-7da7-4767-95be-61346733a3b1))
  (pad "B12" smd circle (at -3.75 15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 72d4fa74-dfc0-40fe-bc33-bd89e72d039b))
  (pad "B13" smd circle (at -2.25 15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 48ee5c1d-cc77-4ef9-a4c2-7571884d8b46))
  (pad "B14" smd circle (at -0.75 15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 0bef09dc-628f-476a-9fe3-cac9a9cddcf3))
  (pad "B15" smd circle (at 0.75 15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 714b4624-3956-47e1-b749-ba0486efbbb0))
  (pad "B16" smd circle (at 2.25 15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 5cdad448-d275-4a3f-97c4-0755ae0b0830))
  (pad "B17" smd circle (at 3.75 15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp a4966966-11d0-4369-beff-23f3e565b209))
  (pad "B18" smd circle (at 5.25 15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp bce8de8a-7593-49d7-b06f-7bbf42de0f3d))
  (pad "B19" smd circle (at 6.75 15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 947b6bee-d2d7-4a0c-8f09-c5d009e3c580))
  (pad "B20" smd circle (at 8.25 15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp c569eaef-a285-4ad3-8f15-b1ccf212f808))
  (pad "B21" smd circle (at 9.75 15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 6571f385-d6be-4ab3-ac39-1f8f1132d7d6))
  (pad "B22" smd circle (at 11.25 15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 2c52315c-d85d-4562-87c3-10039882dc1c))
  (pad "B23" smd circle (at 12.75 15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 55e9522b-b50e-4461-8783-6537c93b14d4))
  (pad "B24" smd circle (at 14.25 15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 31fdc307-160d-401c-b5bb-53b7ea5b6fcf))
  (pad "B25" smd circle (at 15.75 15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 029412f6-4479-4cc3-bc5a-d7cc8da3ac4d))
  (pad "B26" smd circle (at 17.25 15) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 0ed844a1-09a0-46d1-bc05-9c6d76b3534c))
  (pad "C1" smd circle (at -20.25 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp c5de4824-ff99-4c2a-9fe0-6e29b653c6f0))
  (pad "C2" smd circle (at -18.75 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp dedf8ef4-358e-4304-a3d6-51ae26c77337))
  (pad "C3" smd circle (at -17.25 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 44399b43-9818-42ae-9a50-2344cdc0193d))
  (pad "C4" smd circle (at -15.75 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 5997092d-a63c-4c01-ae34-9b139aa6759a))
  (pad "C5" smd circle (at -14.25 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 25f8cfad-c0ba-4800-9d31-73c8dcb78b3b))
  (pad "C6" smd circle (at -12.75 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp adcbd24b-177c-4685-a5e8-98f63415a96e))
  (pad "C7" smd circle (at -11.25 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 2fef3360-2886-428a-a24f-84401c176790))
  (pad "C8" smd circle (at -9.75 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp ee3a9c02-3c07-499f-9395-5765a86743e5))
  (pad "C9" smd circle (at -8.25 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 3e0ca737-7fde-4582-8888-bb6b303a10f5))
  (pad "C10" smd circle (at -6.75 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 095bf5f8-7333-4790-bdd5-cdcda8f47b51))
  (pad "C11" smd circle (at -5.25 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 12c617a4-d71e-429c-ac3e-4c92e556f925))
  (pad "C12" smd circle (at -3.75 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 219bbed3-c241-41d0-a4bb-3e5ec90e819a))
  (pad "C13" smd circle (at -2.25 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp b95ca651-2e74-48c5-84d5-6729d6254633))
  (pad "C14" smd circle (at -0.75 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 29d70181-4a90-4bca-bab7-da3e14557bbe))
  (pad "C15" smd circle (at 0.75 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp dce8e165-8ff1-49cd-a526-4cebb4e969e0))
  (pad "C16" smd circle (at 2.25 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 7d560573-70aa-4759-ac8d-592fffcda549))
  (pad "C17" smd circle (at 3.75 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp b615a3f5-88b5-4a11-abd3-eef74b11c17d))
  (pad "C18" smd circle (at 5.25 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp db2ef7b8-d7cd-4e58-af0e-1cff3a0762e4))
  (pad "C19" smd circle (at 6.75 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp aa9486f7-9d2e-4eeb-8e60-0ee7e6884131))
  (pad "C20" smd circle (at 8.25 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp cec2d9d6-4e3c-4b46-88a6-f07491cb50b1))
  (pad "C21" smd circle (at 9.75 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 39b3da70-f6d6-4b5c-b33a-9fd133a8a87a))
  (pad "C22" smd circle (at 11.25 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp a4f4b6c5-46ba-4a48-a7e7-46e3eda5f4f5))
  (pad "C23" smd circle (at 12.75 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 6b6b29d1-909c-4476-addf-59a34e6b4641))
  (pad "C24" smd circle (at 14.25 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 2fbf86f9-7c5a-4009-b6a2-3d5263b845dd))
  (pad "C25" smd circle (at 15.75 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp edcc5cb5-a123-41e5-a522-1cc90453c853))
  (pad "C26" smd circle (at 17.25 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 466e516c-0b85-407b-a45d-baaff63c84f5))
  (pad "C27" smd circle (at 18.75 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp f69cbc57-4a89-4663-8b18-beef7a1a8e02))
  (pad "C28" smd circle (at 20.25 13.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp ab080455-5e32-40a4-996b-9813cf79c89f))
  (pad "D1" smd circle (at -20.25 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp cbfc6255-e66e-4f2f-a523-62c1f19088aa))
  (pad "D2" smd circle (at -18.75 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 90f592e2-c51b-4e63-925a-ac95d0f2dea7))
  (pad "D3" smd circle (at -17.25 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp cc288f97-3d3f-4cc7-9d6c-c1930f29af59))
  (pad "D4" smd circle (at -15.75 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp a3b16120-f272-4689-ada1-d0d502f324b5))
  (pad "D5" smd circle (at -14.25 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 0d294867-106f-4623-8453-583f85da2337))
  (pad "D6" smd circle (at -12.75 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp f564a060-38c3-4ea1-ac50-880fc31668cc))
  (pad "D7" smd circle (at -11.25 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 2b101b2b-faa7-41dd-9f60-f6efd50ad535))
  (pad "D8" smd circle (at -9.75 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 82dd1802-d16b-4a19-bb4a-77d9bb7a25de))
  (pad "D9" smd circle (at -8.25 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 78a6dd27-8dab-48df-9e28-cb41191adcb4))
  (pad "D10" smd circle (at -6.75 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 22cab589-b80e-4809-91c7-c02ceead2f3d))
  (pad "D11" smd circle (at -5.25 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 4953247f-975b-4eef-b35a-2ff8012bbf5a))
  (pad "D12" smd circle (at -3.75 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp fac714ec-dada-4755-8268-a25e352bc57d))
  (pad "D13" smd circle (at -2.25 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 281b765b-72b7-4c01-849f-b52c4a2ad9ff))
  (pad "D14" smd circle (at -0.75 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp a4d7200d-1033-4918-bf90-3b3fc3d6a4f5))
  (pad "D15" smd circle (at 0.75 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 7a1603ae-780e-4d5b-88a9-9f50213581be))
  (pad "D16" smd circle (at 2.25 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp edc6f656-ad43-4892-b722-766616b586c6))
  (pad "D17" smd circle (at 3.75 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp a0ed8989-e91f-41b1-bed1-455e4557b593))
  (pad "D18" smd circle (at 5.25 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 319aa7a5-421f-4e7e-9dab-784f5c036174))
  (pad "D19" smd circle (at 6.75 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp bd36792a-36d4-42bc-8b70-8c9a79faa9ee))
  (pad "D20" smd circle (at 8.25 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 6fa02839-4cf7-4408-88f8-669f95a544fe))
  (pad "D21" smd circle (at 9.75 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 9fcfff1d-e7de-4104-9a83-6f2f60e55610))
  (pad "D22" smd circle (at 11.25 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 38974c9b-e93e-465e-b429-fa2ce49d8f4b))
  (pad "D23" smd circle (at 12.75 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 2373b945-0038-4692-9fc4-084db59cd9ce))
  (pad "D24" smd circle (at 14.25 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp ab52d5bd-8ea4-4fb0-962c-bc52bde4b150))
  (pad "D25" smd circle (at 15.75 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 01618b6a-f257-4c45-9c63-dfcedc380135))
  (pad "D26" smd circle (at 17.25 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp cb89f388-82e9-4672-b74b-6ebc6711d5c9))
  (pad "D27" smd circle (at 18.75 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp dbd244c9-680b-4430-be42-923bcf487114))
  (pad "D28" smd circle (at 20.25 12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp cb5fee26-e5a6-43b6-bb55-2f5731293e93))
  (pad "E1" smd circle (at -20.25 10.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 78c0a02c-946a-438e-abca-97e2322d11d2))
  (pad "E2" smd circle (at -18.75 10.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 05e2b436-9db0-4476-b537-ea76fef3d726))
  (pad "E3" smd circle (at -17.25 10.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 97245a19-ee89-43f6-9f6d-9fa1dcb6165e))
  (pad "E4" smd circle (at -15.75 10.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 4e1356d9-c8aa-41e5-af5d-bb8686b80348))
  (pad "E25" smd circle (at 15.75 10.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp bc69dc3f-42ce-4d77-b62f-508ca0132db2))
  (pad "E26" smd circle (at 17.25 10.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 44a680b2-a669-4cac-8b8c-463269bf35fc))
  (pad "E27" smd circle (at 18.75 10.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 786f42fa-5101-42c7-b0db-2bf8bb7815bb))
  (pad "E28" smd circle (at 20.25 10.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 3e6393b8-3aca-475a-9239-b4777e9fe633))
  (pad "F1" smd circle (at -20.25 9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 55a3c4dc-7851-400d-a03f-19a92ee1441c))
  (pad "F2" smd circle (at -18.75 9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 7c7a8b5b-e6f5-45e6-9350-4e09ca0624de))
  (pad "F3" smd circle (at -17.25 9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 5b82bde6-0ac9-4b23-8ee0-432cd3d14021))
  (pad "F4" smd circle (at -15.75 9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp fb37e45d-2186-4890-a516-19fd7b66ba4b))
  (pad "F7" smd circle (at -11.25 9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp c82cceba-2828-4587-ba59-4dd15b32457d))
  (pad "F8" smd circle (at -9.75 9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 0c56139b-5de9-42a0-a531-0b01a89719ba))
  (pad "F9" smd circle (at -8.25 9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 2a92cded-59a0-4b69-a6b4-fe3e844a380d))
  (pad "F10" smd circle (at -6.75 9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp b395125e-e99e-49d9-a5b9-aec56a3d5290))
  (pad "F11" smd circle (at -5.25 9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp c7b2952f-d765-485e-b019-ad064d2da702))
  (pad "F12" smd circle (at -3.75 9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 0779f33a-d4b9-4966-8e78-c664a75f0845))
  (pad "F13" smd circle (at -2.25 9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 098cf718-f8ff-4361-bee4-cd7cb55d9d53))
  (pad "F14" smd circle (at -0.75 9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 4f91d4cf-8ea3-485a-a71a-8ed591813c24))
  (pad "F15" smd circle (at 0.75 9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 5a658a71-e59c-4932-bbc5-6e8ebd09a35c))
  (pad "F16" smd circle (at 2.25 9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 7150eb44-7203-4a93-ba71-8f7434c7d556))
  (pad "F17" smd circle (at 3.75 9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 9cde7f8c-8f86-4515-8863-3897b7b3415a))
  (pad "F18" smd circle (at 5.25 9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp d89e2426-de7a-46fc-90bb-d161f110bfb0))
  (pad "F19" smd circle (at 6.75 9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp c19f8aa0-9a4d-4fe8-94f8-67ba19e5c3b7))
  (pad "F20" smd circle (at 8.25 9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 06793f63-5472-496c-90c8-a8703b691745))
  (pad "F21" smd circle (at 9.75 9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 506222bb-586b-4e0d-a729-7e11afd19017))
  (pad "F22" smd circle (at 11.25 9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 484b7642-4d05-4e24-a349-a0cee5630767))
  (pad "F25" smd circle (at 15.75 9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 98af5c3a-4de0-436f-9952-c9f780b6a977))
  (pad "F26" smd circle (at 17.25 9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp ca905925-5150-4e43-88ed-c63f34d3d632))
  (pad "F27" smd circle (at 18.75 9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 45a7d0ed-fd97-48c0-892d-57206ce442c6))
  (pad "F28" smd circle (at 20.25 9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 98eea2f1-462d-4dc9-b927-450aaef21a2c))
  (pad "G1" smd circle (at -20.25 7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp f8cc9bf2-ca4b-47af-b843-8df717c4cc2e))
  (pad "G2" smd circle (at -18.75 7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 81d56833-82be-4774-b12a-3763d2b97426))
  (pad "G3" smd circle (at -17.25 7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp d5e86086-923d-420d-a988-f2a8ed48ef63))
  (pad "G4" smd circle (at -15.75 7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp ce2c8cd4-903e-4542-8cfc-18e341ffcc4a))
  (pad "G7" smd circle (at -11.25 7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 41f6cc70-d848-432f-b236-a7e5c168f51d))
  (pad "G8" smd circle (at -9.75 7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 2214055c-65d0-4740-ae65-aa42a13f3dba))
  (pad "G9" smd circle (at -8.25 7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 65a960fa-5bf2-447f-bba9-e5a4801b3376))
  (pad "G10" smd circle (at -6.75 7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp b2818d0e-5cb9-4f32-bf43-9f2324804a0f))
  (pad "G11" smd circle (at -5.25 7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp bdb243a8-f7ee-4e0c-95d5-26607d81ac8b))
  (pad "G12" smd circle (at -3.75 7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp ae14983d-39ca-4b4a-becf-6b5429a1d8b1))
  (pad "G13" smd circle (at -2.25 7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp f9000ee4-3c28-40be-8b54-78672eb9b5b6))
  (pad "G14" smd circle (at -0.75 7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp cb8dc134-2e45-4a95-9ec4-7fe418db2dc1))
  (pad "G15" smd circle (at 0.75 7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp ac9a1035-8568-4eac-93bc-bfc0e23b0ed3))
  (pad "G16" smd circle (at 2.25 7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 192e93cc-e775-4f3b-be4b-5035e8f864a0))
  (pad "G17" smd circle (at 3.75 7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 957fd3c5-3743-49a6-9653-70f5fab02d3b))
  (pad "G18" smd circle (at 5.25 7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp a0e4f40a-796c-4238-931a-aec4188fc990))
  (pad "G19" smd circle (at 6.75 7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 91133884-3c73-40cc-8cc8-a1cfdcfeb210))
  (pad "G20" smd circle (at 8.25 7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 7dc647e9-eeac-4a12-ad22-5da28e31b2be))
  (pad "G21" smd circle (at 9.75 7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp bff754cd-e1a1-470a-99cf-69fed701c126))
  (pad "G22" smd circle (at 11.25 7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp b539b65d-8b77-4894-8c6a-0634a04c139e))
  (pad "G25" smd circle (at 15.75 7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp ac265bf9-b283-4645-aa35-2f3a3230be03))
  (pad "G26" smd circle (at 17.25 7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp b0307bd3-d7be-4405-a3e7-c7c162274456))
  (pad "G27" smd circle (at 18.75 7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 25eda9f4-191d-4d9a-9a6c-8fb13e507112))
  (pad "G28" smd circle (at 20.25 7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp cf4d7d12-5f5a-4358-a9fe-c7d4558ce7cf))
  (pad "GD1" smd roundrect (at -19.5 15.75) (size 2.3 2.3) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.0652173913)
    (chamfer_ratio 0.3) (chamfer bottom_left)
    (thermal_bridge_angle 45) (tstamp 4083923c-0138-4c92-8e81-a7565122f098))
  (pad "GD2" smd roundrect (at 19.5 15.75) (size 2.3 2.3) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.0652173913)
    (thermal_bridge_angle 45) (tstamp c1a142e0-50cb-49d7-ac46-d12124b6a25f))
  (pad "GD3" smd roundrect (at -19.5 -15.75) (size 2.3 2.3) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.0652173913)
    (thermal_bridge_angle 45) (tstamp ce44d0ab-56c1-4541-ad77-62d0d6916207))
  (pad "GD4" smd roundrect (at 19.5 -15.75) (size 2.3 2.3) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.0652173913)
    (thermal_bridge_angle 45) (tstamp 8dd77591-924a-4f70-9141-6487ce8a590a))
  (pad "GD5" smd roundrect (at -3.2 -1.6) (size 2.3 2.3) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.0652173913)
    (thermal_bridge_angle 45) (tstamp 977372e5-3b5d-47bd-8240-69d366b10f32))
  (pad "GD6" smd roundrect (at 0 -1.6) (size 2.3 2.3) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.0652173913)
    (thermal_bridge_angle 45) (tstamp edb5e7a2-bb62-43db-9297-eba050472db4))
  (pad "GD7" smd roundrect (at 3.2 -1.6) (size 2.3 2.3) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.0652173913)
    (thermal_bridge_angle 45) (tstamp a2857711-b952-4178-8eee-c2d6a3429b18))
  (pad "GD8" smd roundrect (at -3.2 1.6) (size 2.3 2.3) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.0652173913)
    (thermal_bridge_angle 45) (tstamp c055f871-a36f-442a-9a33-b479741af07f))
  (pad "GD9" smd roundrect (at 0 1.6) (size 2.3 2.3) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.0652173913)
    (thermal_bridge_angle 45) (tstamp fe70dc66-0a42-4b56-9fa0-4ff79223e598))
  (pad "GD10" smd roundrect (at 3.2 1.6) (size 2.3 2.3) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.0652173913)
    (thermal_bridge_angle 45) (tstamp 2b090409-fbcd-4c76-a2f5-b46d4cb534a6))
  (pad "H1" smd circle (at -20.25 6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 7dd69f34-41c7-4f87-95b9-d21aaeacadba))
  (pad "H2" smd circle (at -18.75 6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 2c5e9cb6-9c60-4c72-9f74-a1a611d714d9))
  (pad "H3" smd circle (at -17.25 6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 239c385a-775f-4cfb-b5fa-fce1579e01bd))
  (pad "H4" smd circle (at -15.75 6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp df785ba8-3787-4950-8aeb-29b97ccd6ed3))
  (pad "H7" smd circle (at -11.25 6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 640b80f9-8778-4944-ae91-af2c67efec48))
  (pad "H8" smd circle (at -9.75 6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 7315d49d-3827-4285-b79c-22253ad16e4a))
  (pad "H9" smd circle (at -8.25 6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 4fb1d8d3-7e0d-4286-87da-1c104818e1aa))
  (pad "H10" smd circle (at -6.75 6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp c17c134b-840d-4421-907a-b49919fecf61))
  (pad "H11" smd circle (at -5.25 6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 942cfd9d-eab1-48d4-8f4f-86b064cd2e67))
  (pad "H12" smd circle (at -3.75 6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp faae91ba-815a-45e5-af73-56cee13b749a))
  (pad "H13" smd circle (at -2.25 6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp a5aa2e33-1573-4d42-9884-e5eff136cf9c))
  (pad "H14" smd circle (at -0.75 6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 43c6bf08-3830-4568-9206-5e2d271304c6))
  (pad "H15" smd circle (at 0.75 6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp d98401ce-8663-4729-a5e8-e5e29f85c97f))
  (pad "H16" smd circle (at 2.25 6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 2afd990d-d78b-4cba-900f-718248a86a3d))
  (pad "H17" smd circle (at 3.75 6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp ac4e8af8-b57c-4915-870b-4faaa0bbd466))
  (pad "H18" smd circle (at 5.25 6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp fa18028e-0312-4f92-ba1d-aa54b683d648))
  (pad "H19" smd circle (at 6.75 6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 52c50780-1043-4fee-990e-0ebd88de3c9d))
  (pad "H20" smd circle (at 8.25 6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 12b05a45-7452-4e73-83cc-a49b50221b4c))
  (pad "H21" smd circle (at 9.75 6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp c57d5e45-5fd7-4e9d-839a-7a67a6668e2e))
  (pad "H22" smd circle (at 11.25 6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 2683c368-73f3-420e-a845-92cff43fc5e8))
  (pad "H25" smd circle (at 15.75 6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 421b9938-af83-46b4-bec8-b2fbebfaf9e2))
  (pad "H26" smd circle (at 17.25 6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 90a819b2-cdaf-47fd-80e5-615cf555d836))
  (pad "H27" smd circle (at 18.75 6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 25ed4331-9882-4052-952e-afd9432fcab9))
  (pad "H28" smd circle (at 20.25 6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp ab32fde6-a555-49a1-a6c5-8e5c246f9727))
  (pad "J1" smd circle (at -20.25 4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 95c2da1d-8a63-4f02-b35d-3c136a1c294c))
  (pad "J2" smd circle (at -18.75 4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 355e56cd-3875-4d62-a6fe-22ee667cc141))
  (pad "J3" smd circle (at -17.25 4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 627c2225-0b66-4999-a1ed-9651297eb073))
  (pad "J4" smd circle (at -15.75 4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 5e08d929-f023-47b9-aa86-d3a889f4b767))
  (pad "J7" smd circle (at -11.25 4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 20dc2cb0-9131-4946-a2f1-c6c484aeceae))
  (pad "J8" smd circle (at -9.75 4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 497bbbaa-94ac-4506-975a-4dbcf9c06f43))
  (pad "J9" smd circle (at -8.25 4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 8f776385-5f98-4af6-898a-1f96d27b666f))
  (pad "J10" smd circle (at -6.75 4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp f87eb6c8-a35b-4c32-adb8-da1f4966bfa3))
  (pad "J11" smd circle (at -5.25 4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp b8a0a60a-ec5c-4c5d-a796-c18409a3ed28))
  (pad "J12" smd circle (at -3.75 4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 69aa3e97-31f1-4ada-ba11-2cfdf778e844))
  (pad "J13" smd circle (at -2.25 4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 40d1fa80-814b-4433-911b-46ec5797e9c7))
  (pad "J14" smd circle (at -0.75 4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 30bbf51b-0493-475b-bbbb-f030ffebd8f3))
  (pad "J15" smd circle (at 0.75 4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 002f850c-e10a-434f-b475-5bcfb0a2a5df))
  (pad "J16" smd circle (at 2.25 4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 6a6b3e8c-1e2a-4a18-8fe4-26e77aa35770))
  (pad "J17" smd circle (at 3.75 4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 740f6b4f-0fcb-4535-a414-d98fa13331b9))
  (pad "J18" smd circle (at 5.25 4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp b21bec96-5827-405d-a76b-4b06bb11f217))
  (pad "J19" smd circle (at 6.75 4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp f2fa45be-f84c-4703-85a5-479597a6be24))
  (pad "J20" smd circle (at 8.25 4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 5bb2b9bb-fd24-4caf-9fd4-291d7f8b4e67))
  (pad "J21" smd circle (at 9.75 4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp abaacc5f-aae0-443e-83dd-29a46479d14e))
  (pad "J22" smd circle (at 11.25 4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 6e1a8016-35b9-4e1f-a1c2-1c617a879cc0))
  (pad "J25" smd circle (at 15.75 4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 332cbf43-d3b8-4e10-afe1-507447d10b2e))
  (pad "J26" smd circle (at 17.25 4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 3c21feed-482d-4899-b2b4-70d7fd168efa))
  (pad "J27" smd circle (at 18.75 4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp c0e69b26-3d35-459e-ac0e-170ffd7b0c10))
  (pad "J28" smd circle (at 20.25 4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp c37505ac-d571-408f-b715-aee8d3f3594d))
  (pad "K1" smd circle (at -20.25 3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 2854795b-ae12-47d8-97e2-f52a10456e5e))
  (pad "K2" smd circle (at -18.75 3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp a8cf1012-7c62-4b1d-a9ac-a835cc717bc5))
  (pad "K3" smd circle (at -17.25 3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 239a594e-a94d-4bcd-9bbd-08da7be03180))
  (pad "K4" smd circle (at -15.75 3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 67f5f7e7-36f7-4dd2-aa15-185dc1e205f5))
  (pad "K7" smd circle (at -11.25 3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 4eaffd56-af9e-4b27-9d9d-f33d08036d13))
  (pad "K8" smd circle (at -9.75 3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp e4d4fbcc-cff8-4e43-82ba-609c93c40cfe))
  (pad "K9" smd circle (at -8.25 3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 40ca8055-958e-481a-ab5b-0c780bdb383c))
  (pad "K10" smd circle (at -6.75 3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 1b6b4757-5791-4e6f-871a-c9c4fd2a463e))
  (pad "K19" smd circle (at 6.75 3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 1fc3e910-874d-458d-96b9-b7abf6c696b1))
  (pad "K20" smd circle (at 8.25 3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 16327911-d231-4b2b-8e79-4b77d5ebca5d))
  (pad "K21" smd circle (at 9.75 3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp be918822-3180-4d44-baed-39a099de5ecc))
  (pad "K22" smd circle (at 11.25 3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp dc4303b4-12c0-41b0-9903-3572fd88ec0c))
  (pad "K25" smd circle (at 15.75 3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 0b846158-345b-47dd-a36e-f5bbb821e6d0))
  (pad "K26" smd circle (at 17.25 3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 8fa71639-8d3d-4768-a8bd-a4f6f7cb4cf2))
  (pad "K27" smd circle (at 18.75 3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 85510aeb-d083-4b9c-82ea-991cde372890))
  (pad "K28" smd circle (at 20.25 3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp b6b1adc8-cf4e-4cbb-8a30-9e2f983d045a))
  (pad "L1" smd circle (at -20.25 1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp be8c1f20-af00-4bc6-a6f5-dae2b1be3886))
  (pad "L2" smd circle (at -18.75 1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp bc8edc36-30da-4bc6-af82-2661b524aa21))
  (pad "L3" smd circle (at -17.25 1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp cc06a4a7-3516-4bbe-a2ca-4b6181d3e25a))
  (pad "L4" smd circle (at -15.75 1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp e1eca169-f2a9-40c7-82ca-c444dcf427f9))
  (pad "L7" smd circle (at -11.25 1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 2fd92c03-ad68-4c74-af34-6333a0c742b6))
  (pad "L8" smd circle (at -9.75 1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 24a3ed86-af44-4794-939a-0516baf73f7d))
  (pad "L9" smd circle (at -8.25 1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp e1dedba3-2c42-4893-a5cd-71aa08323d0f))
  (pad "L10" smd circle (at -6.75 1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp fab2de7a-2f3c-4124-9caf-cb84e73b66a7))
  (pad "L19" smd circle (at 6.75 1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 8e7585ce-e7e2-4237-b995-e75560f5d554))
  (pad "L20" smd circle (at 8.25 1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp b01c264e-6ad0-48fb-89fe-141378a1a3bc))
  (pad "L21" smd circle (at 9.75 1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 1d6d7db0-0838-4ce5-8bf4-b2aade51bf66))
  (pad "L22" smd circle (at 11.25 1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 17a8aabe-9cb2-45ff-88ba-c6d73c0aad3a))
  (pad "L25" smd circle (at 15.75 1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp d11e4277-e97f-4d65-8dd4-6ee29ed49fec))
  (pad "L26" smd circle (at 17.25 1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 56f4bd41-bf9f-409d-bed7-6bf6f0fd20f9))
  (pad "L27" smd circle (at 18.75 1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 8c5606e3-a154-496c-a7ec-e221c6f6996f))
  (pad "L28" smd circle (at 20.25 1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp e68c9031-9a92-4378-a0a7-b8285dcd7b72))
  (pad "M1" smd circle (at -20.25 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp bc9108ff-13ab-4b41-a1a3-9784e094d57c))
  (pad "M2" smd circle (at -18.75 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp e54c546c-7bb8-41a2-a1a9-3542ba6b7f6d))
  (pad "M3" smd circle (at -17.25 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp e4c3b86b-f17c-49c5-bf24-4c52159b40fa))
  (pad "M4" smd circle (at -15.75 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 51dc8bb1-202d-4de2-b383-0f36342fe36a))
  (pad "M7" smd circle (at -11.25 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 69a25777-77d7-41f2-a771-84807e5b4960))
  (pad "M8" smd circle (at -9.75 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 8ba3bd06-b9a9-4276-a069-7e5483971e27))
  (pad "M9" smd circle (at -8.25 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp a7e0c560-3642-4dbf-bccb-bd078cf955eb))
  (pad "M10" smd circle (at -6.75 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 70f61ed3-fd2d-4355-9aba-58cfc35a34f6))
  (pad "M19" smd circle (at 6.75 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp bd3af1fa-735a-4442-864c-fd481b4581de))
  (pad "M20" smd circle (at 8.25 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp aafd8967-e7bb-4d02-a061-6bfdb33ad1e8))
  (pad "M21" smd circle (at 9.75 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 0e688665-3268-4dcd-b79d-296b80d72413))
  (pad "M22" smd circle (at 11.25 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 2efdf92e-57fd-4a12-81e4-a4d88730a291))
  (pad "M25" smd circle (at 15.75 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp c2ceebce-1d08-4b9d-9379-0c061dcaced7))
  (pad "M26" smd circle (at 17.25 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 0cccf47b-41b9-47f5-bf7e-cf57dc4086c9))
  (pad "M27" smd circle (at 18.75 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp b1a7d011-3876-4471-9b24-edfb2ee90887))
  (pad "M28" smd circle (at 20.25 0) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 299ca03b-6621-4710-9521-98c80fea5082))
  (pad "N1" smd circle (at -20.25 -1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 9aaf512a-ef50-4cdc-a5c6-5b9bd059337f))
  (pad "N2" smd circle (at -18.75 -1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 7c263ec4-b5d7-4b50-81f1-0f0fe4131d16))
  (pad "N3" smd circle (at -17.25 -1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp a524532f-c2d2-465d-a1c4-64c21f9ae68c))
  (pad "N4" smd circle (at -15.75 -1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 53deb7e4-5b05-4204-9547-fcc68a66359b))
  (pad "N7" smd circle (at -11.25 -1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 7ab5e97a-be5f-4446-be70-1d5c4f50e09e))
  (pad "N8" smd circle (at -9.75 -1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 368eb804-f755-40fb-8fb9-8e4d942fc1ef))
  (pad "N9" smd circle (at -8.25 -1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 558209b8-7655-483e-9b71-4c40d42d4c33))
  (pad "N10" smd circle (at -6.75 -1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 29b53692-2a21-4f79-879a-30aa676d8e53))
  (pad "N19" smd circle (at 6.75 -1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 1047c634-f70d-43af-bab7-f819da471524))
  (pad "N20" smd circle (at 8.25 -1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp ad3d30a4-d55f-43fb-8eb0-9d1806a28aad))
  (pad "N21" smd circle (at 9.75 -1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 7cc42fed-db1f-4854-81b6-52820dc48bfe))
  (pad "N22" smd circle (at 11.25 -1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp b2df9568-9159-43f0-96f6-df76ee2da8bf))
  (pad "N25" smd circle (at 15.75 -1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp e984ec04-b76d-4141-80ed-129d42f6c39d))
  (pad "N26" smd circle (at 17.25 -1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 76fd6c59-d984-401c-8a6c-6a99fe78cdf6))
  (pad "N27" smd circle (at 18.75 -1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 579693fc-7abb-4866-b796-01def9cf1c65))
  (pad "N28" smd circle (at 20.25 -1.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp e72a0f38-3d52-4371-ab96-44d75c431740))
  (pad "P1" smd circle (at -20.25 -3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp a4a44b52-3966-4762-9218-3e46fd8c1a48))
  (pad "P2" smd circle (at -18.75 -3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp beb672ab-17fc-40af-a36e-2de59ef85f8e))
  (pad "P3" smd circle (at -17.25 -3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 4b9a9332-db4d-47b7-94c1-205210b7f394))
  (pad "P4" smd circle (at -15.75 -3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp cff4b0f2-6532-4463-be1e-71facdce2c55))
  (pad "P7" smd circle (at -11.25 -3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 73af7e2b-7e00-44ce-ba7c-1966d3e79e88))
  (pad "P8" smd circle (at -9.75 -3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp d4c65f12-7047-4f7f-8699-3adb5584f0b6))
  (pad "P9" smd circle (at -8.25 -3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 1258afc6-e32a-434d-a796-f6c68cf6471c))
  (pad "P10" smd circle (at -6.75 -3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp cec5cba0-ed7d-4f52-b00e-f6126a04a875))
  (pad "P19" smd circle (at 6.75 -3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 168a8a38-0635-4018-adc2-21a814f133f8))
  (pad "P20" smd circle (at 8.25 -3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 5d677138-4ada-44b5-9746-de99007a75c7))
  (pad "P21" smd circle (at 9.75 -3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp b3e8af8d-f0ac-4f2a-a106-d3c838341bf2))
  (pad "P22" smd circle (at 11.25 -3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp d1dbf93b-f772-466c-931a-a961be8c5120))
  (pad "P25" smd circle (at 15.75 -3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 85587429-c8ad-4503-8743-0e7e90c8c24f))
  (pad "P26" smd circle (at 17.25 -3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp e54745b4-ce67-490d-b554-2683e38ce5d1))
  (pad "P27" smd circle (at 18.75 -3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 18ab0ba3-1d26-4132-81ba-a857d3662adf))
  (pad "P28" smd circle (at 20.25 -3) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp bf096582-0fa0-4453-82ba-9b0f4b3b3212))
  (pad "R1" smd circle (at -20.25 -4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp ecd5687f-cc09-40cc-b271-7777723b8184))
  (pad "R2" smd circle (at -18.75 -4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 7ef6519e-2a04-499d-ad26-39e1acb94588))
  (pad "R3" smd circle (at -17.25 -4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 3c1e34ec-c268-4e25-85fe-1ac2ed2e9207))
  (pad "R4" smd circle (at -15.75 -4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp f1210fdd-cb9a-49bd-abb4-a7bdb0561f86))
  (pad "R7" smd circle (at -11.25 -4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp ac82addc-607a-423a-ad0a-6b67a2597741))
  (pad "R8" smd circle (at -9.75 -4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp ed04017e-d5fc-4625-a778-02ad47cf08ce))
  (pad "R9" smd circle (at -8.25 -4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 033252d0-49ec-449b-b9f8-f0c5c298fe5d))
  (pad "R10" smd circle (at -6.75 -4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 03a59a0d-a4fc-4fab-963f-ae7cf33968db))
  (pad "R11" smd circle (at -5.25 -4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 87c78359-ba42-4054-a91d-2111760820ad))
  (pad "R12" smd circle (at -3.75 -4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 4b04fdb0-16d0-4c59-af21-b4ebfe9f36dd))
  (pad "R13" smd circle (at -2.25 -4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 03129288-1491-4741-b453-641124b4c761))
  (pad "R14" smd circle (at -0.75 -4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 384946b6-60b9-419a-8298-88e67c1d2bc3))
  (pad "R15" smd circle (at 0.75 -4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp fc6d4f65-88ca-4592-97cd-8cb589facaa1))
  (pad "R16" smd circle (at 2.25 -4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 9064002a-34f7-40a1-8260-9da14e85d347))
  (pad "R17" smd circle (at 3.75 -4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 0892ea18-2281-4d8c-bf56-61b1fcb36aa6))
  (pad "R18" smd circle (at 5.25 -4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp dbcf9e9d-31a0-4e43-ac17-f206d038f0ca))
  (pad "R19" smd circle (at 6.75 -4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 768aec72-49c9-4473-9d6f-b7563cae9faf))
  (pad "R20" smd circle (at 8.25 -4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 38eff7c3-f551-453e-97ec-518404f7bcff))
  (pad "R21" smd circle (at 9.75 -4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp c5f3904f-fe17-45ab-a1ba-7f0928bc1886))
  (pad "R22" smd circle (at 11.25 -4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 907aa902-3354-4b14-a25c-08f93ba54295))
  (pad "R25" smd circle (at 15.75 -4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp e06a2321-e2c9-4aa2-9211-c4fb3ea46529))
  (pad "R26" smd circle (at 17.25 -4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 29a59227-4bee-4eef-be37-620abcc2e336))
  (pad "R27" smd circle (at 18.75 -4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 7686a37f-4ceb-4b19-92d5-4f08a8fcf2b9))
  (pad "R28" smd circle (at 20.25 -4.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp ff76c1af-4e58-4f6f-89c2-0722cd09c505))
  (pad "T1" smd circle (at -20.25 -6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 1c822e6e-0388-4b8d-93af-f3360870165d))
  (pad "T2" smd circle (at -18.75 -6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 106080f6-fea9-4f50-99cf-2ba08c06fc76))
  (pad "T3" smd circle (at -17.25 -6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 3fdc45b2-6438-4a77-a23e-6610b3b83990))
  (pad "T4" smd circle (at -15.75 -6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 4eccd619-e3e6-4b1c-bbff-3d48dc85e4b9))
  (pad "T7" smd circle (at -11.25 -6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 60abf49f-204f-4b6a-86f7-14618501af75))
  (pad "T8" smd circle (at -9.75 -6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 9824652f-3684-49ea-8351-3a01f0ceb225))
  (pad "T9" smd circle (at -8.25 -6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp f24bc20b-f9c9-4e15-af79-8024a146f917))
  (pad "T10" smd circle (at -6.75 -6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 921af414-275d-44ce-a6a9-c9ec282b70e7))
  (pad "T11" smd circle (at -5.25 -6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 252be24c-9f4f-4c8a-bf39-6dbcbb9d01b2))
  (pad "T12" smd circle (at -3.75 -6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 3f6ba6a3-0177-4329-8baa-2a28aee831cd))
  (pad "T13" smd circle (at -2.25 -6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp cb7e5e72-e6b4-4300-b61b-4c51288eaad0))
  (pad "T14" smd circle (at -0.75 -6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 97aa83ac-e478-424a-a70a-57fef4c9108a))
  (pad "T15" smd circle (at 0.75 -6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp e59d0f21-4747-4b98-9361-4251a598f76e))
  (pad "T16" smd circle (at 2.25 -6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 51e16800-df87-4e17-95d5-11420c2afedb))
  (pad "T17" smd circle (at 3.75 -6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 10107fd9-739f-43ee-9bc2-4c31b0bed5f1))
  (pad "T18" smd circle (at 5.25 -6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 912d70f7-c55d-4e02-9099-90258385a94f))
  (pad "T19" smd circle (at 6.75 -6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 8b06a3b7-7150-41e6-8513-d2f3e01f04c1))
  (pad "T20" smd circle (at 8.25 -6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp c065a29f-a97e-4ba4-84ca-11894ba44e31))
  (pad "T21" smd circle (at 9.75 -6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp c5ac631e-079b-401a-9a65-94cc8af24708))
  (pad "T22" smd circle (at 11.25 -6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 5339adc5-b535-4dff-a311-2c59a65d3867))
  (pad "T25" smd circle (at 15.75 -6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp a6d571be-b472-48f7-b8fa-ee25a426f653))
  (pad "T26" smd circle (at 17.25 -6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp eea468eb-e2ba-43ab-81e9-051325e9977e))
  (pad "T27" smd circle (at 18.75 -6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp bc745d46-8fa8-4821-88de-d82cbf871f2e))
  (pad "T28" smd circle (at 20.25 -6) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 71f24df3-4f75-43b9-98ea-f8b28544396d))
  (pad "U1" smd circle (at -20.25 -7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 88f704c3-2d43-426b-ac03-2f3e6d6b70bb))
  (pad "U2" smd circle (at -18.75 -7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp c8b8caf8-e1b5-4629-b741-d6155b9f78b6))
  (pad "U3" smd circle (at -17.25 -7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 7d03d53f-79b7-4c6e-beeb-ae4d9e9103b3))
  (pad "U4" smd circle (at -15.75 -7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp f05fca9c-9ba9-4a7b-bb74-9573d7a7c839))
  (pad "U7" smd circle (at -11.25 -7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp f3d5884e-147e-442c-9978-b12e73c3fd10))
  (pad "U8" smd circle (at -9.75 -7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp baf7bbf8-8104-4467-9a6c-cde6faa324aa))
  (pad "U9" smd circle (at -8.25 -7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp d48b7061-523f-4046-b63f-33c37d2c51f7))
  (pad "U10" smd circle (at -6.75 -7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 437c4a00-e496-4999-8a5e-dad1d4430000))
  (pad "U11" smd circle (at -5.25 -7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 3ed444ff-6ed5-41fa-a442-2f58ccec6d69))
  (pad "U12" smd circle (at -3.75 -7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 536ff819-31a9-44b8-9fec-c71be68336cb))
  (pad "U13" smd circle (at -2.25 -7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp f251af42-efb1-4278-86b5-affda0ee315f))
  (pad "U14" smd circle (at -0.75 -7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 07e1ffda-f346-466a-8dd4-f8b615b7451b))
  (pad "U15" smd circle (at 0.75 -7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp a834910c-df30-4772-8e16-ca164854cace))
  (pad "U16" smd circle (at 2.25 -7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp c31f7e14-a7e8-4d38-b579-ce6babaa4909))
  (pad "U17" smd circle (at 3.75 -7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 336252a4-3055-4bbe-8191-e07807e7feae))
  (pad "U18" smd circle (at 5.25 -7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 250389be-6a9c-4d7d-949d-873221b5ac91))
  (pad "U19" smd circle (at 6.75 -7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp e21b137e-87bc-4263-a15b-5c756903ca3d))
  (pad "U20" smd circle (at 8.25 -7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp c9728433-1e7b-406e-b5e4-50f5e2eb891e))
  (pad "U21" smd circle (at 9.75 -7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 60cfabbe-bd9d-4183-a2c5-e26c8c87ce13))
  (pad "U22" smd circle (at 11.25 -7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 1fd022a8-b2ef-4674-895f-11e6416bd14d))
  (pad "U25" smd circle (at 15.75 -7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 97ea7b39-4a05-4362-8a88-f630d877c1b7))
  (pad "U26" smd circle (at 17.25 -7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 499a1080-4f55-4e4b-8480-6017b6a2dfbf))
  (pad "U27" smd circle (at 18.75 -7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp a3e6ab1e-be05-4e36-ae8c-76728481920d))
  (pad "U28" smd circle (at 20.25 -7.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 0a7ff6ec-304e-41a1-a83c-fc901043e2d2))
  (pad "V1" smd circle (at -20.25 -9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 1945f95e-b9c0-4509-9e8e-7186fae9b310))
  (pad "V2" smd circle (at -18.75 -9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 386d734e-46ec-41cd-9b4f-51acd498891d))
  (pad "V3" smd circle (at -17.25 -9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 9cfbe979-6a08-4fae-9071-6d7f30581c3d))
  (pad "V4" smd circle (at -15.75 -9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 60cce403-7ec3-459a-af7d-44c68acdbfe1))
  (pad "V7" smd circle (at -11.25 -9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 113d1bf8-ab60-46c9-a4ea-b6e7d6d46764))
  (pad "V8" smd circle (at -9.75 -9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp df69b27d-8e26-4ed4-993d-54d37d1ad2db))
  (pad "V9" smd circle (at -8.25 -9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 983cdfd6-0e23-4210-a9fd-a3a0bbe08dac))
  (pad "V10" smd circle (at -6.75 -9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp ba8efd3d-a280-4d4f-b8f0-e8944b4b8868))
  (pad "V11" smd circle (at -5.25 -9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp c601a248-2efb-4c17-bdce-49fea3b6eab2))
  (pad "V12" smd circle (at -3.75 -9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 3de44217-e9ff-4e61-92ea-60a47f2c6988))
  (pad "V13" smd circle (at -2.25 -9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 553fbe9d-8531-49fe-b57c-d5bd284f97e9))
  (pad "V14" smd circle (at -0.75 -9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 00969bb6-aafe-4677-b64a-d64a6f5ff4df))
  (pad "V15" smd circle (at 0.75 -9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp e547af01-a100-47cf-b060-02a2612eec6e))
  (pad "V16" smd circle (at 2.25 -9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 7be752f9-e652-4c79-b186-99908295df15))
  (pad "V17" smd circle (at 3.75 -9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp d4ba160e-483b-4752-b853-e7479dee5d47))
  (pad "V18" smd circle (at 5.25 -9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp e30099d4-286c-475f-a62c-edee373a3c13))
  (pad "V19" smd circle (at 6.75 -9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 9041cc4b-d6ee-46ce-b76a-6c6ebc12b2b4))
  (pad "V20" smd circle (at 8.25 -9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp ba4d3858-d1e6-4729-a034-a61b0a5ca31d))
  (pad "V21" smd circle (at 9.75 -9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp d8d6224f-70c1-44d0-a656-42731f8e7516))
  (pad "V22" smd circle (at 11.25 -9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp fc4cccc8-a5d2-4ad3-8a37-5deda1fd99fa))
  (pad "V25" smd circle (at 15.75 -9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 2b37dc8e-2d29-402c-bb1e-9838bfbb0ff5))
  (pad "V26" smd circle (at 17.25 -9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp a760a9ab-3352-47a3-a620-b2b671964fe1))
  (pad "V27" smd circle (at 18.75 -9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 70148c96-b18c-4947-a6fe-e54ad1b2b9f9))
  (pad "V28" smd circle (at 20.25 -9) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp b42f5583-bfb7-45fa-84da-4f1a0bf60e0c))
  (pad "W1" smd circle (at -20.25 -10.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 5f51401e-5f6a-431d-844c-bb1134f63dac))
  (pad "W2" smd circle (at -18.75 -10.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 9c57095a-8258-43c0-a27b-e9ded735bd77))
  (pad "W3" smd circle (at -17.25 -10.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp d25a4c56-e427-4422-a9c1-73fdc6fbcffe))
  (pad "W4" smd circle (at -15.75 -10.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 89a85088-92a8-4082-ae97-6218d1cadf1f))
  (pad "W5" smd circle (at -14.25 -10.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 2af5e4d0-2006-45fd-aa3d-4a94def013f4))
  (pad "W25" smd circle (at 15.75 -10.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 2aac8264-9b90-4cc2-b433-01fec0f7a5d9))
  (pad "W26" smd circle (at 17.25 -10.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp f936a342-70cb-4a98-a3ec-c9b3e83b2b6d))
  (pad "W27" smd circle (at 18.75 -10.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 36eea6a4-a5fb-4d2f-9ef3-e9babed6f4df))
  (pad "W28" smd circle (at 20.25 -10.5) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp aac9bc33-f05e-42c5-95b9-186ed4bef00a))
  (pad "Y1" smd circle (at -20.25 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp b959fed6-9b0c-4f3b-8946-efdfc2d4c169))
  (pad "Y2" smd circle (at -18.75 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 45f27276-0ccf-4157-921a-959393176b54))
  (pad "Y3" smd circle (at -17.25 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 93327a34-c7cd-41df-b331-2df9a1b5366a))
  (pad "Y4" smd circle (at -15.75 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 06873637-f8fe-4aff-bc56-2c46151fb0b2))
  (pad "Y5" smd circle (at -14.25 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 5000f777-48ee-4a3d-aa79-13767cb007d1))
  (pad "Y6" smd circle (at -12.75 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 9d5610bb-b931-4dec-ae46-7cb2912c51a8))
  (pad "Y7" smd circle (at -11.25 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 3bc28334-748b-4dee-bdfa-f6bd69a0b431))
  (pad "Y8" smd circle (at -9.75 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 120e4d41-10b3-4fa8-b1d0-f0ee0762d180))
  (pad "Y9" smd circle (at -8.25 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp b0781719-fe6d-436f-ab75-39fd69d9afb0))
  (pad "Y10" smd circle (at -6.75 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 7f3fe984-a704-4186-b66f-5c0132cd6939))
  (pad "Y11" smd circle (at -5.25 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 79e81716-1a97-4e7a-a5a6-7c4a80a98293))
  (pad "Y12" smd circle (at -3.75 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp a0cb792b-3680-4b4c-849a-334c8a47346e))
  (pad "Y13" smd circle (at -2.25 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 286b4a07-2b8d-49ae-9003-5224c17fc5df))
  (pad "Y14" smd circle (at -0.75 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp b236a276-47e5-4308-86c8-9717bfcf73da))
  (pad "Y15" smd circle (at 0.75 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 8cadf241-4041-40c2-8fe7-3aace9b3a539))
  (pad "Y16" smd circle (at 2.25 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 840cdd2f-70c1-49cc-8f59-3a3e6edc9109))
  (pad "Y17" smd circle (at 3.75 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp dbd30637-5d09-4276-b0e9-45ec36052391))
  (pad "Y18" smd circle (at 5.25 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp be85b237-59ee-42ff-be27-70bfe4191701))
  (pad "Y19" smd circle (at 6.75 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp a8b04a62-6199-4dc6-ad3e-f99c67620ea9))
  (pad "Y20" smd circle (at 8.25 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 40a402e7-1426-4e5c-97a8-db262588d93c))
  (pad "Y21" smd circle (at 9.75 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 1656f304-6dc3-4fe2-8e8c-98d4a747bbe9))
  (pad "Y22" smd circle (at 11.25 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp b7fe02f8-1e64-4cc3-b904-3f0beff9f8c6))
  (pad "Y23" smd circle (at 12.75 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 1c3e8fea-ca2f-4217-a378-e43ce0a9637e))
  (pad "Y24" smd circle (at 14.25 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 015c39ca-c46b-43d4-b80b-62952275797f))
  (pad "Y25" smd circle (at 15.75 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp c6c63e6e-ace7-4c67-944d-1cc3c32e05f0))
  (pad "Y26" smd circle (at 17.25 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp b8575397-9ecb-4264-857b-37f303bb5030))
  (pad "Y27" smd circle (at 18.75 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 8448146f-a042-4f8f-b598-8982216b1778))
  (pad "Y28" smd circle (at 20.25 -12) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.125) (tstamp 378310ed-196f-4b6b-8deb-5260e78ef516))
  (model "${KICAD7_3DMODEL_DIR}/Module.3dshapes/Thundercomm C6490.step"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz -90 0 -90))
  )
)
