(module "USB_C_Receptacle_XKB_U262-241N-4BVC16" (layer "F.Cu") (tedit 5FA41FFE)
  (attr through_hole)
  (fp_text reference "REF**" (at -5.5 -3.25 90 unlocked) (layer "F.SilkS")
    (effects (font (size 1 1) (thickness 0.15)) (justify left))
    (tstamp 7d15cbfb-f7f7-428d-b892-182d4e90ac92)
  )
  (fp_text value "USB_C_Receptacle_XKB_U262-241N-4BVC16" (at 0 1 unlocked) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 9f1a0ca8-e871-4d37-aa36-389326cb391f)
  )
  (fp_text user "${REF}" (at 0 2.5 unlocked) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 1d5761db-4f86-43ba-86b9-d0eca0410c15)
  )
  (fp_poly (pts (xy 4.62 0)
    (xy -4.62 0)
    (xy -4.62 -5.95)
    (xy 4.62 -5.95)) (layer "Dwgs.User") (width 0) (tstamp ccadbc77-7c40-40b0-80e5-adfc0e0d6cb2))
  (pad "A1" smd roundrect (at -2.625 -7.975) (size 0.25 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2) (tstamp d3665295-1f8e-41df-b893-4b7932e4e495))
  (pad "A2" smd roundrect (at -2.125 -7.975) (size 0.25 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2) (tstamp ec12650a-6743-48dd-bc67-1b3c95fabdbd))
  (pad "A3" smd roundrect (at -1.625 -7.975) (size 0.25 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2) (tstamp 8f176604-af53-4b41-9d40-182ffe96c95d))
  (pad "A4" smd roundrect (at -1.125 -7.975) (size 0.25 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2) (tstamp 857c11b2-5632-4bc9-9ba5-227215feb5f8))
  (pad "A5" smd roundrect (at -0.625 -7.975) (size 0.25 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2) (tstamp b4cc0c68-876d-4a5b-b567-1bd1c3adaf13))
  (pad "A6" smd roundrect (at -0.125 -7.975) (size 0.25 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2) (tstamp dc9b8679-df86-42ef-bcdc-43cd385f1fe2))
  (pad "A7" smd roundrect (at 0.375 -7.975) (size 0.25 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2) (tstamp ba5484a9-6574-406a-8ba2-9c2f6bba2b86))
  (pad "A8" smd roundrect (at 0.875 -7.975) (size 0.25 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2) (tstamp f7184246-5141-40ad-8366-62a1f08aa646))
  (pad "A9" smd roundrect (at 1.375 -7.975) (size 0.25 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2) (tstamp 2f3e36f1-dc17-4efc-921b-6d1a3dd8cd79))
  (pad "A10" smd roundrect (at 1.875 -7.975) (size 0.25 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2) (tstamp e63af27b-a4a7-471b-996d-e4204c2596f7))
  (pad "A11" smd roundrect (at 2.375 -7.975) (size 0.25 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2) (tstamp 195f4705-82f6-458c-a751-40fcde023b12))
  (pad "A12" smd roundrect (at 2.875 -7.975) (size 0.25 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2) (tstamp 8bf6f5f5-1f2b-4c08-8678-5996a329d696))
  (pad "B1" smd roundrect (at 2.625 -6.575) (size 0.25 0.85) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2) (tstamp eadf3708-538f-4a31-b978-29e658530ebc))
  (pad "B2" smd roundrect (at 2.125 -6.575) (size 0.25 0.85) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2) (tstamp dda53f2d-257f-4ecf-a3a0-cc94665e2c95))
  (pad "B3" smd roundrect (at 1.625 -6.575) (size 0.25 0.85) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2) (tstamp 647e77fc-0c77-4d6b-bed1-38c9228013dd))
  (pad "B4" smd roundrect (at 1.125 -6.575) (size 0.25 0.85) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2) (tstamp 8d2e7b15-6435-4ce0-923b-d439111206ff))
  (pad "B5" smd roundrect (at 0.625 -6.575) (size 0.25 0.85) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2) (tstamp d3974bdf-390f-4128-b746-9b7db7d2fdc4))
  (pad "B6" smd roundrect (at 0.125 -6.575) (size 0.25 0.85) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2) (tstamp 9fc63317-ae08-495e-8ea2-c7f1c6492068))
  (pad "B7" smd roundrect (at -0.375 -6.575) (size 0.25 0.85) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2) (tstamp 91a67c4e-4c1a-48be-b173-0842017a900d))
  (pad "B8" smd roundrect (at -0.875 -6.575) (size 0.25 0.85) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2) (tstamp cb9a4ae9-3654-457d-bad0-e53ad57af376))
  (pad "B9" smd roundrect (at -1.375 -6.575) (size 0.25 0.85) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2) (tstamp d305b9e4-4c13-44ab-980d-3294664beb03))
  (pad "B10" smd roundrect (at -1.875 -6.575) (size 0.25 0.85) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2) (tstamp 362c4891-bd2d-46f9-af3b-d5e52c676751))
  (pad "B11" smd roundrect (at -2.375 -6.575) (size 0.25 0.85) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2) (tstamp f2ffd084-5e5a-4925-91f6-1fa9f7d4c8bb))
  (pad "B12" smd roundrect (at -2.875 -6.575) (size 0.25 0.85) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2) (tstamp 0f2ddd57-a698-45ba-9e9c-825ce6cd3ca7))
  (pad "S1" thru_hole oval (at 5.65 -2.45) (size 0.8 1.4) (drill oval 0.6 1.2) (layers *.Cu *.Mask) (tstamp 14b2c6a1-17a8-45f3-bc93-bb15ea469fb9))
  (pad "S1" thru_hole oval (at -4.32 -7.3) (size 0.8 1.8) (drill oval 0.6 1.6) (layers *.Cu *.Mask) (tstamp 27fb77d9-4a04-4855-81cf-d0f5ae4fde2f))
  (pad "S1" thru_hole oval (at -5.65 -2.45) (size 0.8 1.4) (drill oval 0.6 1.2) (layers *.Cu *.Mask) (tstamp 28dd715a-b593-4bfa-916b-175ccb5ab321))
  (pad "S1" thru_hole oval (at 4.32 -7.3) (size 0.8 1.8) (drill oval 0.6 1.6) (layers *.Cu *.Mask) (tstamp 67a70ff4-ef09-4738-a736-bd09f929db66))
  (pad "S1" thru_hole oval (at 4.02 -6.8) (size 1.4 0.8) (drill oval 1.2 0.6) (layers *.Cu *.Mask) (tstamp d1d97da1-d891-4f47-9ba2-0d22a061101f))
  (pad "S1" thru_hole oval (at -4.02 -6.8) (size 1.4 0.8) (drill oval 1.2 0.6) (layers *.Cu *.Mask) (tstamp dc6ef8a7-ad79-444a-a828-08697401d6b7))
)
