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  (property "MFG" "Microchip")
  (property "MPN" "MCP23017-E/ML")
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    (chamfer_ratio 0.1) (chamfer top_right bottom_right) (tstamp 68726ff4-c15f-4825-af65-5e12727b0ae9))
  (pad "22" smd roundrect (at 1.95 -2.8375 270) (size 1.025 0.3) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.33)
    (chamfer_ratio 0.1) (chamfer top_right bottom_right) (tstamp a79a8c4d-6814-4437-8e15-3d30ce6d1b90))
  (pad "23" smd roundrect (at 1.3 -2.8375 270) (size 1.025 0.3) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.33)
    (chamfer_ratio 0.1) (chamfer top_right bottom_right) (tstamp ccea1441-e2d0-45ea-b93f-83cdd09ef6b6))
  (pad "24" smd roundrect (at 0.65 -2.8375 270) (size 1.025 0.3) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.33)
    (chamfer_ratio 0.1) (chamfer top_right bottom_right) (tstamp cd3ccb7d-3b1c-4487-9cfe-c196e8d5edfc))
  (pad "25" smd roundrect (at 0 -2.8375 270) (size 1.025 0.3) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.33)
    (chamfer_ratio 0.1) (chamfer top_right bottom_right) (tstamp adf55de8-ed3d-4805-be36-19bbda91ea77))
  (pad "26" smd roundrect (at -0.65 -2.8375 270) (size 1.025 0.3) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.33)
    (chamfer_ratio 0.1) (chamfer top_right bottom_right) (tstamp 3c9b9396-5e9b-45a5-a211-fc13291ae2a1))
  (pad "27" smd roundrect (at -1.3 -2.8375 270) (size 1.025 0.3) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.33)
    (chamfer_ratio 0.1) (chamfer top_right bottom_right) (tstamp 2830b73d-77ab-4b09-8145-8dd4c8faaed5))
  (pad "28" smd roundrect (at -1.95 -2.8375 270) (size 1.025 0.3) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.33)
    (chamfer_ratio 0.1) (chamfer top_right bottom_right) (tstamp eba750f3-762a-4575-9306-fcf708c824d6))
  (pad "29" smd roundrect (at 0 0) (size 4.25 4.25) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.01176470588) (tstamp 70f73e0d-5090-4707-94c9-446862348d15))
  (model "${KICAD6_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/QFN-28-1EP_6x6mm_P0.65mm_EP4.25x4.25mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
