(module TI_DSBGA-4_0.806x0.806mm_Layout2x1x2_P0.4mm (layer F.Cu) (tedit 5B7D15AA)
  (solder_mask_margin -0.025)
  (clearance 0.025)
  (attr smd)
  (fp_text reference U3 (at 0 -1) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value TI_TLV705_DSBGA (at 0 0.6) (layer F.Fab)
    (effects (font (size 0.127 0.127) (thickness 0.03175)))
  )
  (fp_line (start -0.403 -0.403) (end 0.403 -0.403) (layer F.Fab) (width 0.05))
  (fp_line (start 0.403 -0.403) (end 0.403 0.403) (layer F.Fab) (width 0.05))
  (fp_line (start 0.403 0.403) (end -0.403 0.403) (layer F.Fab) (width 0.05))
  (fp_line (start -0.403 0.403) (end -0.403 -0.403) (layer F.Fab) (width 0.05))
  (pad A1 smd circle (at -0.2 -0.2) (size 0.23 0.23) (layers F.Cu F.Paste F.Mask))
  (pad A2 smd circle (at 0.2 -0.2) (size 0.23 0.23) (layers F.Cu F.Paste F.Mask))
  (pad B1 smd circle (at -0.2 0.2) (size 0.23 0.23) (layers F.Cu F.Paste F.Mask))
  (pad B2 smd circle (at 0.2 0.2) (size 0.23 0.23) (layers F.Cu F.Paste F.Mask))
)
