(module Microchip_MIC2815 (layer F.Cu) (tedit 5A2BD6A1)
  (solder_mask_margin 0.025)
  (solder_paste_margin -0.001)
  (attr smd)
  (fp_text reference U1 (at 0 -4) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value Microchip_MIC2815 (at 0 4.25) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_circle (center -3.8 -3.4) (end -3.7 -3.4) (layer F.SilkS) (width 0.15))
  (fp_line (start -3.5 3.5) (end -3.5 2.5) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.5 3.5) (end -3.5 3.5) (layer F.SilkS) (width 0.15))
  (fp_line (start 3.5 3.5) (end 2.5 3.5) (layer F.SilkS) (width 0.15))
  (fp_line (start 3.5 2.5) (end 3.5 3.5) (layer F.SilkS) (width 0.15))
  (fp_line (start 3.5 -3.5) (end 3.5 -2.5) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.5 -3.5) (end 3.5 -3.5) (layer F.SilkS) (width 0.15))
  (fp_line (start -3.5 -3.5) (end -2.5 -3.5) (layer F.SilkS) (width 0.15))
  (fp_line (start -3.5 -2.5) (end -3.5 -3.5) (layer F.SilkS) (width 0.15))
  (fp_line (start 3 3) (end 3 -3) (layer F.Fab) (width 0.1))
  (fp_line (start -3 3) (end 3 3) (layer F.Fab) (width 0.1))
  (fp_line (start -3 -3) (end -3 3) (layer F.Fab) (width 0.1))
  (fp_line (start -3 -3) (end 3 -3) (layer F.Fab) (width 0.1))
  (pad 33 smd roundrect (at 0 -1.25 180) (size 4.8 2.3) (layers B.Cu B.Mask)(roundrect_rratio 0.05))
  (pad 12 smd roundrect (at 0.65 1.5 180) (size 2.35 2.7) (layers B.Cu B.Mask)(roundrect_rratio 0.05))
  (pad 5 smd roundrect (at -1.85 1.5 180) (size 2.1 2.7) (layers B.Cu B.Mask)(roundrect_rratio 0.05))
  (pad 16 smd roundrect (at 2.5 2.25 180) (size 0.7 0.7) (layers F.Cu F.Paste)(roundrect_rratio 0.25))
  (pad 16 smd roundrect (at 2.5 1.25 180) (size 0.7 0.7) (layers F.Cu F.Paste)(roundrect_rratio 0.25))
  (pad 12 smd roundrect (at 0.75 1.5 180) (size 1.6 2) (layers F.Cu F.Paste)(roundrect_rratio 0.25))
  (pad 5 smd roundrect (at -2 1.75 180) (size 1.3 2) (layers F.Cu F.Paste)(roundrect_rratio 0.25))
  (pad 33 smd roundrect (at 1.5 -1.25 180) (size 1.1 2) (layers F.Cu F.Paste)(roundrect_rratio 0.25))
  (pad 33 smd roundrect (at 0 -1.25 180) (size 1.1 2) (layers F.Cu F.Paste)(roundrect_rratio 0.25))
  (pad 33 smd roundrect (at -1.5 -1.25 180) (size 1.1 2) (layers F.Cu F.Paste)(roundrect_rratio 0.25))
  (pad 16 thru_hole circle (at 2.5 2.25 180) (size 0.7 0.7) (drill 0.33) (layers *.Cu))
  (pad 16 thru_hole circle (at 2.5 1.25 180) (size 0.7 0.7) (drill 0.33) (layers *.Cu))
  (pad 12 thru_hole circle (at 0.25 2.5 180) (size 0.7 0.7) (drill 0.33) (layers *.Cu))
  (pad 12 thru_hole circle (at 0.25 1.5 180) (size 0.7 0.7) (drill 0.33) (layers *.Cu))
  (pad 12 thru_hole circle (at 1.25 2.5 180) (size 0.7 0.7) (drill 0.33) (layers *.Cu))
  (pad 12 thru_hole circle (at 1.25 1.5 180) (size 0.7 0.7) (drill 0.33) (layers *.Cu))
  (pad 12 thru_hole circle (at 1.25 0.5 180) (size 0.7 0.7) (drill 0.33) (layers *.Cu))
  (pad 12 thru_hole circle (at 0.25 0.5 180) (size 0.7 0.7) (drill 0.33) (layers *.Cu))
  (pad 5 thru_hole circle (at -2.25 0.5 180) (size 0.7 0.7) (drill 0.33) (layers *.Cu))
  (pad 5 thru_hole circle (at -2.25 1.5 180) (size 0.7 0.7) (drill 0.33) (layers *.Cu))
  (pad 5 thru_hole circle (at -2.25 2.5 180) (size 0.7 0.7) (drill 0.33) (layers *.Cu))
  (pad 5 thru_hole circle (at -1.25 2.5 180) (size 0.7 0.7) (drill 0.33) (layers *.Cu))
  (pad 5 thru_hole circle (at -1.25 1.5 180) (size 0.7 0.7) (drill 0.33) (layers *.Cu))
  (pad 5 thru_hole circle (at -1.25 0.5 180) (size 0.7 0.7) (drill 0.33) (layers *.Cu))
  (pad 33 thru_hole circle (at 2 -0.75 180) (size 0.7 0.7) (drill 0.33) (layers *.Cu))
  (pad 33 thru_hole circle (at 1 -0.75 180) (size 0.7 0.7) (drill 0.33) (layers *.Cu))
  (pad 33 thru_hole circle (at 0 -0.75 180) (size 0.7 0.7) (drill 0.33) (layers *.Cu))
  (pad 33 thru_hole circle (at -1 -0.75 180) (size 0.7 0.7) (drill 0.33) (layers *.Cu))
  (pad 33 thru_hole circle (at -2 -0.75 180) (size 0.7 0.7) (drill 0.33) (layers *.Cu))
  (pad 33 thru_hole circle (at 1 -1.75 180) (size 0.7 0.7) (drill 0.33) (layers *.Cu))
  (pad 33 thru_hole circle (at 2 -1.75 180) (size 0.7 0.7) (drill 0.33) (layers *.Cu))
  (pad 33 thru_hole circle (at -1 -1.75 180) (size 0.7 0.7) (drill 0.33) (layers *.Cu))
  (pad 33 thru_hole circle (at 0 -1.75 180) (size 0.7 0.7) (drill 0.33) (layers *.Cu))
  (pad 33 thru_hole circle (at -2 -1.75 180) (size 0.7 0.7) (drill 0.33) (layers *.Cu))
  (pad 16 smd roundrect (at 2.475 1.8 180) (size 0.75 2) (layers F.Cu F.Mask)(roundrect_rratio 0.05))
  (pad 12 smd roundrect (at 0.65 1.5 180) (size 2.35 2.7) (layers F.Cu F.Mask)(roundrect_rratio 0.05))
  (pad 5 smd roundrect (at -1.85 1.5 180) (size 2.1 2.7) (layers F.Cu F.Mask)(roundrect_rratio 0.05))
  (pad 24 smd oval (at 3.05 -2.275 180) (size 0.6 0.3) (layers F.Cu F.Paste))
  (pad 23 smd oval (at 3.05 -1.625 180) (size 0.6 0.3) (layers F.Cu F.Paste))
  (pad 22 smd oval (at 3.05 -0.975 180) (size 0.6 0.3) (layers F.Cu F.Paste))
  (pad 21 smd oval (at 3.05 -0.325 180) (size 0.6 0.3) (layers F.Cu F.Paste))
  (pad 20 smd oval (at 3.05 0.325 180) (size 0.6 0.3) (layers F.Cu F.Paste))
  (pad 4 smd oval (at -3.05 -0.325 180) (size 0.6 0.3) (layers F.Cu F.Paste))
  (pad 3 smd oval (at -3.05 -0.975 180) (size 0.6 0.3) (layers F.Cu F.Paste))
  (pad 2 smd oval (at -3.05 -1.625 180) (size 0.6 0.3) (layers F.Cu F.Paste))
  (pad 1 smd oval (at -3.05 -2.275 180) (size 0.6 0.3) (layers F.Cu F.Paste))
  (pad 32 smd oval (at -2.275 -3.05 90) (size 0.6 0.3) (layers F.Cu F.Paste))
  (pad 31 smd oval (at -1.625 -3.05 90) (size 0.6 0.3) (layers F.Cu F.Paste))
  (pad 30 smd oval (at -0.975 -3.05 90) (size 0.6 0.3) (layers F.Cu F.Paste))
  (pad 29 smd oval (at -0.325 -3.05 90) (size 0.6 0.3) (layers F.Cu F.Paste))
  (pad 28 smd oval (at 0.325 -3.05 90) (size 0.6 0.3) (layers F.Cu F.Paste))
  (pad 27 smd oval (at 0.975 -3.05 90) (size 0.6 0.3) (layers F.Cu F.Paste))
  (pad 26 smd oval (at 1.625 -3.05 90) (size 0.6 0.3) (layers F.Cu F.Paste))
  (pad 25 smd oval (at 2.275 -3.05 90) (size 0.6 0.3) (layers F.Cu F.Paste))
  (pad 33 smd roundrect (at 0 -1.25 180) (size 4.8 2.3) (layers F.Cu F.Mask)(roundrect_rratio 0.05))
  (pad 32 smd roundrect (at -2.275 -3.05 90) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 31 smd roundrect (at -1.625 -3.05 90) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 30 smd roundrect (at -0.975 -3.05 90) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 29 smd roundrect (at -0.325 -3.05 90) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 28 smd roundrect (at 0.325 -3.05 90) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 27 smd roundrect (at 0.975 -3.05 90) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 26 smd roundrect (at 1.625 -3.05 90) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 25 smd roundrect (at 2.275 -3.05 90) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 16 smd roundrect (at 2.275 3.05 90) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 12 smd roundrect (at 1.625 3.05 90) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 12 smd roundrect (at 0.975 3.05 90) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 12 smd roundrect (at 0.325 3.05 90) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 12 smd roundrect (at -0.325 3.05 90) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 5 smd roundrect (at -0.975 3.05 90) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 5 smd roundrect (at -1.625 3.05 90) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 5 smd roundrect (at -2.275 3.05 90) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 24 smd roundrect (at 3.05 -2.275 180) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 23 smd roundrect (at 3.05 -1.625 180) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 22 smd roundrect (at 3.05 -0.975 180) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 21 smd roundrect (at 3.05 -0.325 180) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 20 smd roundrect (at 3.05 0.325 180) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 16 smd roundrect (at 3.05 0.975 180) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 16 smd roundrect (at 3.05 1.625 180) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 16 smd roundrect (at 3.05 2.275 180) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 5 smd roundrect (at -3.05 2.275) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 5 smd roundrect (at -3.05 1.625) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 5 smd roundrect (at -3.05 0.975) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 5 smd roundrect (at -3.05 0.325) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 4 smd roundrect (at -3.05 -0.325) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 3 smd roundrect (at -3.05 -0.975) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 2 smd roundrect (at -3.05 -1.625) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 1 smd roundrect (at -3.05 -2.275) (size 0.7 0.35) (layers F.Cu F.Mask)(roundrect_rratio 0.25))
  (pad 16 smd roundrect (at 2.475 1.8 180) (size 0.75 2) (layers B.Cu B.Mask)(roundrect_rratio 0.05))
)
